SLUUCR7A January   2023  – December 2023

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Warning and Caution
  5. 2Introduction
    1. 2.1 Performance Specification
    2. 2.2 Dual Package Layout
    3. 2.3 Modifications
      1. 2.3.1 Input and Output Capacitors
      2. 2.3.2 Loop Response Measurement
  6. 3Setup
    1. 3.1 Connector Descriptions
    2. 3.2 Hardware Setup
  7. 4TPS62830xRZEREVM Test Results
  8. 5Board Layout
  9. 6Schematic and Bill of Materials
    1. 6.1 Schematic
    2. 6.2 Bill of Materials
  10. 7Revision History

2.2 Dual Package Layout

Because both the QFN and SOT583 packages have the same pinout, there is also the possibility for board designers to overlap both package footprints like in Figure 2-1. This overlap gives more flexibility to switch between packages when there is shortage in supply of one. The TPS62830xRZEREVM does not have this overlap and is only designed for the QFN package.

GUID-20230110-SS0I-WZDV-12GG-TZLDKK0XCNKD-low.svg Figure 2-1 Overlapped QFN and SOT583 Footprints