SLUUCS6A february   2023  – august 2023 UCC14340-Q1 , UCC14341-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 U1 Component Selection
    2. 1.2 Pin Configuration and Functions
  5. 2Description
    1. 2.1 EVM Electrical Performance Specifications
  6. 3Schematic
  7. 4EVM Setup and Operation
    1. 4.1 Recommended Test Equipment
    2. 4.2 External Connections for Easy Evaluation
    3. 4.3 Powering the EVM
      1. 4.3.1 Power on for Start-up
      2. 4.3.2 Power off for Shutdown
    4. 4.4 EVM Test Points
    5. 4.5 Probing the EVM
  8. 5 Performance Data
    1. 5.1  Efficiency Data
    2. 5.2  Regulation Data
    3. 5.3  Steady State Input Current
    4. 5.4  Start-up Waveforms
    5. 5.5  Inrush Current
    6. 5.6  AC Ripple Voltage
    7. 5.7  EN-to-/PG Timing
    8. 5.8  RLIM
    9. 5.9  Fault Protection
      1. 5.9.1 Output UVLO
      2. 5.9.2 Output OVP of COM-VEE
    10. 5.10 Shutdown
    11. 5.11 Thermal Performance
  9. 6Assembly and Printed Circuit Board (PCB) Layers
  10. 7Bill of Materials (BOM)
  11. 8Revision History

6 Assembly and Printed Circuit Board (PCB) Layers

The UCC14341EVM-069 is designed using a four-layer, FR4, PCB, fabricated with 2-ounce copper on all four layers. The EVM, PCB demonstrates the important use of ground planes and tented stitching vias for shielding and improving EMI performance. For higher density PCBs such as automotive traction inverters, the PCB can include several additional signal layers but similar design methodology can be applied as best as possible.


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Figure 6-1 UCC14341EVM-069, Fully Assembled 3D Top View

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Figure 6-2 UCC14341EVM-069, Fully Assembled 3D Bottom View

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Figure 6-3 UCC14341EVM-069, 3D Angle View

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Figure 6-4 UCC14341EVM-069, PCB Top Layer, Assembly

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Figure 6-5 UCC14341EVM-069, GND Layer 2 (same as layer 3)

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Figure 6-6 UCC14341EVM-069, GND Layer 3 (same as layer 2)

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Figure 6-7 UCC14341EVM-069, PCB Bottom Layer, Assembly (mirrored view)