SLVS490K December   2003  – June 2024

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics (TPS2061, TPS2062, TPS2065, and TPS2066)
    6. 6.6 Typical Characteristics (TPS2063 & TPS2067)
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  Power Switch
    3. 8.3  Charge Pump
    4. 8.4  Driver
    5. 8.5  Enable ( ENx or ENx)
    6. 8.6  Current Sense
    7. 8.7  Overcurrent
      1. 8.7.1 Overcurrent Conditions (TPS2063 and TPS2067)
      2. 8.7.2 Overcurrent Conditions (TPS2061, TPS2062, TPS2065, and TPS2066)
    8. 8.8  Overcurrent ( OCx)
    9. 8.9  Thermal Sense
    10. 8.10 Undervoltage Lockout
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Power-supply Considerations
      2. 9.1.2  OC Response
      3. 9.1.3  Power Dissipation and Junction Temperature
      4. 9.1.4  Thermal Protection
      5. 9.1.5  Undervoltage Lockout (UVLO)
      6. 9.1.6  Universal Serial Bus (USB) Applications
      7. 9.1.7  Host/Self-Powered and Bus-powered Hubs
      8. 9.1.8  Low-power Bus-powered and High-Power Bus-Powered Functions
      9. 9.1.9  USB Power-distribution Requirements
      10. 9.1.10 Generic Hot-Plug Applications
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Electrostatic Discharge Caution

TPS2061 TPS2062 TPS2063  TPS2065 TPS2066 TPS2067 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.