The TPS6514x series offers a compact and small power supply solution to provide all three voltages required by thin film transistor (TFT) LCD displays. The auxiliary linear regulator controller can be used to generate a 3.3-V logic power rail for systems powered by a 5-V supply rail only.
The main output VO1 is a 1.6-MHz fixed frequency PWM boost converter providing the source drive voltage for the LCD display. The device is available in two versions with different internal switch current limits to allow the use of a smaller external inductor when lower output power is required. The TPS65140 and TPS65141 has a typical switch current limit of 2.3 A and the TPS65145 has a typical switch current limit of 1.37 A. A fully integrated adjustable charge pump doubler or tripler provides the positive LCD gate drive voltage. An externally adjustable negative charge pump provides the negative gate drive voltage. Due to the high 1.6-MHz switching frequency of the charge pumps, inexpensive and small 220-nF capacitors can be used.
Additionally, the TPS6514x series has a system power good output to indicate when all supply rails are acceptable. For LCD panels powered by 5 V the device has a linear regulator controller using an external transistor to provide a regulated 3.3-V output for the digital circuits. For maximum safety, the TPS65140 and TPS65145 goes into shutdown as soon as one of the outputs is out of regulation. The device can be enabled again by toggling the input or the enable (EN) pin to GND. The TPS65141 does not enter shutdown when one of its outputs is below its power good threshold.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS6514x | HTSSOP (24) | 7.80 mm × 4.40 mm |
VQFN (24) | 4.00 mm × 4.00 mm |
Changes from E Revision (November 2012) to F Revision
PIN | I/O | DESCRIPTION | ||
---|---|---|---|---|
NAME | NO. | |||
HTSSOP | VQFN | |||
BASE | 3 | 6 | O | Base drive output for the external transistor |
C1+ | 16 | 19 | — | Positive terminal of the charge pump flying capacitor |
C1– | 17 | 20 | — | Negative terminal of the charge pump flying capacitor |
C2+ | 14 | 17 | — | Positive terminal for the charge pump flying capacitor. If the device runs in voltage doubler mode, this pin must be left open. |
C2–/MODE | 15 | 18 | — | Negative terminal of the charge pump flying capacitor and charge pump MODE pin. If the flying capacitor is connected to this pin, the converter operates in a voltage tripler mode. If the charge pump must operate in a voltage doubler mode, the flying capacitor is removed and the C2-/MODE pin must be connected to GND. |
COMP | 22 | 1 | — | Compensation pin for the main boost converter. A small capacitor is connected to this pin. |
DRV | 18 | 21 | O | External charge pump driver |
EN | 24 | 3 | I | Enable pin of the device. This pin must be terminated and not be left floating. A logic high enables the device and a logic low shuts down the device. |
ENR | 23 | 2 | I | Enable pin of the linear regulator controller. This pin must be terminated and not be left floating. Logic high enables the regulator and a logic low puts the regulator in shutdown. |
FB1 | 1 | 4 | I | Feedback pin of the boost converter |
FB2 | 21 | 24 | I | Feedback pin of negative charge pump |
FB3 | 12 | 15 | I | Feedback pin of positive charge pump |
FB4 | 2 | 5 | I | Feedback pin of the linear regulator controller. The linear regulator controller is set to a fixed output voltage of 3.3 V or 3 V depending on the version. |
GND | 11, 19 | 14, 22 | — | Ground |
OUT3 | 13 | 16 | O | Positive charge pump output |
PG | 10 | 13 | O | Open-drain output indicating when all outputs VO1, VO2, VO3 are within 10% of their nominal output voltage. The output goes low when one of the outputs falls below 10% of their nominal output voltage. |
PGND | 7, 8 | 10, 11 | — | Power ground |
PowerPAD / Thermal Die | — | — | — | The PowerPAD or exposed thermal die must be connected to power ground pins (PGND) |
REF | 20 | 23 | O | Internal reference output typically 1.23 V |
SUP | 9 | 12 | I | Supply pin of the positive, negative charge pump, boost converter, and gate drive circuit. This pin must be connected to the output of the main boost converter and cannot be connected to any other voltage source. For performance reasons, TI does not recommend connecting a bypass capacitor directly to this pin. |
SW | 5, 6 | 8, 9 | I | Switch pin of the boost converter |
VIN | 4 | 7 | I | Input voltage pin of the device. |
MIN | MAX | UNIT | |
---|---|---|---|
Voltages on pin VIN(2) | –0.3 | 6 | V |
Voltages on pin VO1, SUP, PG (2) | –0.3 | 15.5 | V |
Voltages on pin EN, MODE, ENR(2) | –0.3 | VI+ 0.3 | V |
Voltage on pin SW(2) | 20 | V | |
Power good maximum sink current (PG) | 1 | mA | |
Continuous power dissipation | See Dissipation Ratings | ||
Lead temperature (soldering, 10 s) | 260 | °C | |
Operating junction temperature, TJ | –40 | 150 | °C |
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VI | Input voltage | 2.7 | 5.8 | V | |
L | Inductor(1) | 4.7 | µH | ||
TA | Operating ambient temperature | –40 | 85 | °C | |
TJ | Operating junction temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TPS6514x | UNIT | ||
---|---|---|---|---|
PWP (HTSSOP) | RGE (VQFN) | |||
24 PINS | 24 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 37.2 | 34.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 18.9 | 35.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 16.4 | 11.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.4 | 0.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 16.2 | 11.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.1 | 3.2 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
SUPPLY CURRENT | ||||||
VI | Input voltage | 2.7 | 5.5 | V | ||
IQ | Quiescent current into VIN | ENR = GND, VO3 = 2 × VO1, Boost converter not switching |
0.7 | 0.9 | mA | |
IQCharge | Charge pump quiescent current into SUP | VO1 = SUP = 10 V, VO3 = 2 × VO1 | 1.7 | 2.7 | mA | |
VO1 = SUP = 10 V, VO3 = 3 × VO1 | 3.9 | 6 | ||||
IQEN | LDO controller quiescent current into VIN | ENR = VIN, EN = GND | 300 | 800 | μA | |
ISD | Shutdown current into VIN | EN = ENR = GND | 1 | 10 | μA | |
VUVLO | Undervoltage lockout threshold | VI falling | 2.2 | 2.4 | V | |
Thermal shutdown | Temperature rising | 160 | °C | |||
LOGIC SIGNALS EN, ENR | ||||||
VIH | High level input voltage | 1.5 | V | |||
VIL | Low level input voltage | 0.4 | V | |||
II | Input leakage current | EN = GND or VIN | 0.01 | 0.1 | µA | |
MAIN BOOST CONVERTER | ||||||
VO1 | Output voltage | 5 | 15 | V | ||
VO1 – VIN | Minimum input to output voltage difference | 1 | V | |||
VREF | Reference voltage | 1.205 | 1.213 | 1.219 | V | |
VFB | Feedback regulation voltage |
1.136 | 1.146 | 1.154 | V | |
IFB | Feedback input bias current |
10 | 100 | nA | ||
rDS(on) | N-MOSFET ON-resistance (Q1) | VO1 = 10 V, ISW = 500 mA | 195 | 290 | mΩ | |
VO1 = 5 V, ISW = 500 mA | 285 | 420 | ||||
ILIM | N-MOSFET switch current limit (Q1) | TPS65140, TPS65141 | 1.6 | 2.3 | 2.6 | A |
TPS65145 | 0.96 | 1.37 | 1.56 | A | ||
rDS(on) | P-MOSFET ON-resistance (Q2) | VO1 = 10 V, ISW = 100 mA | 9 | 15 | Ω | |
VO1 = 5 V, ISW = 100 mA | 14 | 22 | ||||
IMAX | Maximum P-MOSFET peak switch current | 1 | A | |||
ILEAK | Switch leakage current | VSW = 15 V | 1 | 10 | µA | |
fSW | Oscillator frequency | 0°C ≤ TA ≤ 85°C | 1.295 | 1.6 | 2.1 | MHz |
–40°C ≤ TA ≤ 85°C | 1.191 | 1.6 | 2.1 | |||
Line regulation | 2.7 V ≤ VI ≤ 5.7 V; ILOAD = 100 mA | 0.012 | %/V | |||
Load regulation | 0 mA ≤ IO ≤ 300 mA | 0.2 | %/A | |||
NEGATIVE CHARGE PUMP VO2 | ||||||
VO2 | Output voltage | –2 | V | |||
VREF | Reference voltage | 1.205 | 1.213 | 1.219 | V | |
VFB | Feedback regulation voltage |
–36 | 0 | 36 | mV | |
IFB | Feedback input bias current |
10 | 100 | nA | ||
rDS(on) | Q8 P-Channel switch rDS(on) | IO = 20 mA | 4.3 | 8 | Ω | |
Q9 N-Channel switch rDS(on) | 2.9 | 4.4 | ||||
IO | Maximum output current | 20 | mA | |||
Line regulation | 7 V ≤ VO1 ≤ 15 V, ILOAD = 10 mA, VO2 = –5 V |
0.09 | %/V | |||
Load regulation | 1 mA ≤ IO ≤ 20 mA, VO2 = –5 V | 0.126 | %/mA | |||
POSITIVE CHARGE PUMP VO3 | ||||||
VO3 | Output voltage | 30 | V | |||
VREF | Reference voltage | 1.205 | 1.213 | 1.219 | V | |
VFB | Feedback regulation voltage |
1.187 | 1.214 | 1.238 | V | |
IFB | Feedback input bias current |
10 | 100 | nA | ||
rDS(on) | Q3 P-Channel switch rDS(on) | IO = 20 mA | 9.9 | 15.5 | Ω | |
Q4 N-Channel switch rDS(on) | 1.1 | 1.8 | ||||
Q5 P-Channel switch rDS(on) | 4.6 | 8.5 | ||||
Q6 N-Channel switch rDS(on) | 1.2 | 2.2 | ||||
VD | D1 – D4 Shottky diode forward voltage |
ID1 – D4 = 40 mA | 610 | 720 | mV | |
IO | Maximum output current | 20 | mA | |||
Line regulation | 10 V ≤ VO1 ≤ 15 V, ILOAD = 10 mA, VO3 = 27 V |
0.56 | %/V | |||
Load regulation | 1 mA ≤ IO ≤ 20 mA, VO3 = 27 V | 0.05 | %/mA | |||
LINEAR REGULATOR CONTROLLER VO4 | ||||||
VO4 | Output voltage | 4.5 V ≤ VI ≤ 5.5 V; 10 mA ≤ IO ≤ 500 mA | 3.2 | 3.3 | 3.4 | V |
IBASE | Maximum base drive current |
VIN – VO4 – VBE ≥ 0.5 V(1) | 13.5 | 19 | mA | |
VIN – VO4 – VBE ≥ 0.75 V (1) | 20 | 27 | ||||
Line regulation | 4.75 V ≤ VI ≤ 5.5 V, ILOAD = 500 mA | 0.186 | %/V | |||
Load regulation | 1 mA ≤ IO ≤ 500 mA, VI = 5 V | 0.064 | %/A | |||
Start-up current | VO4 ≤ 0.8 V | 11 | 20 | 25 | mA | |
SYSTEM POWER GOOD (PG) | ||||||
V(PG, VO1) | Power good threshold(2) | –12 | –8.75% VO1 | –6 | V | |
V(PG, VO2) | –13 | –9.5% VO2 | –5 | V | ||
V(PG, VO3) | –11 | –8% VO3 | –5 | V | ||
VOL | PG output low voltage | I(sink) = 500 μA | 0.3 | V | ||
IL | PG output leakage current | VPG = 5 V | 0.001 | 1 | µA |
PACKAGE | RθJA | TA ≤ 25°C POWER RATING | TA = 70°C POWER RATING | TA = 85°C POWER RATING |
---|---|---|---|---|
24-Pin TSSOP | 30.13 C°/W (PWP soldered) | 3.3 W | 1.83 W | 1.32 W |
24-Pin VQFN | 30 C°/W | 3.3 W | 1.8 W | 1.3 W |
The TPS6514x series consists of a main boost converter operating with a fixed switching frequency of 1.6 MHz to allow for small external components. The boost converter output voltage VO1 is also the input voltage, connected through the pin SUP, for the positive and negative charge pump. The linear regulator controller is independent from this system with its own enable pin. This allows the linear regulator controller to continue to operate while the other supply rails are disabled or in shutdown due to a fault condition on one of their outputs. See Functional Block Diagram for more information.
The main boost converter operates with PWM and a fixed switching frequency of 1.6 MHz. The converter uses a unique fast response, voltage mode controller scheme with input voltage feedforward. This achieves excellent line and load regulation (0.2% A load regulation typical) and allows the use of small external components. To add higher flexibility to the selection of external component values, the device uses external loop compensation. Although the boost converter looks like a nonsynchronous boost converter topology operating in discontinuous mode at light load, the TPS6514x series maintains continuous conduction even at light load currents. This is accomplished using the Virtual Synchronous Converter Technology for improved load transient response. This architecture uses an external Schottky diode and an integrated MOSFET in parallel connected between SW and SUP (see Functional Block Diagram). The integrated MOSFET Q2 allows the inductor current to become negative at light load conditions. For this purpose, a small integrated P-channel MOSFET with typically 10-Ω rDS(on) is sufficient. When the inductor current is positive, the external Schottky diode with the lower forward voltage conducts the current. This causes the converter to operate with a fixed frequency in continuous conduction mode over the entire load current range. This avoids the ringing on the switch pin as seen with a standard nonsynchronous boost converter and allows a simpler compensation for the boost converter.
The TPS6514x series has an open-drain power good output with a maximum sink capability of 1 mA. The power good output goes high as soon as the main boost converter VO1 and the negative and the positive charge pumps are within regulation. The power good output goes low as soon as one of the outputs is out of regulation. In this case, the device goes into shutdown at the same time. See Electrical Characteristics for the power good thresholds.
The device has two enable pins. These pins must be terminated and not left floating to prevent faulty operation. Pulling the enable pin (EN) high enables the device and starts the power-on sequencing with the main boost converter VO1 coming up first, then the negative and positive charge pump. The linear regulator has an independent enable pin (ENR). Pulling this pin low disables the regulator, and pulling this pin high enables this regulator.
If the enable pin (EN) is pulled high, the device starts its power-on sequencing. The main boost converter starts up first with its soft start. If the output voltage reaches 91.25% of its output voltage, the negative charge pump comes up next. The negative charge pump starts with a soft start and when the output voltage reaches 91% of the nominal value, the positive charge pump comes up with the soft start. Pulling the enable pin low shuts down the device. Dependent on load current and output capacitance, each of the outputs comes down.
The TPS6514x series has a fully regulated integrated positive charge pump generating VO3. The input voltage for the charge pump is applied to the SUP pin that is equal to the output of the main boost converter VO1. The charge pump is capable of supplying a minimum load current of 20 mA. Higher load currents are possible depending on the voltage difference between VO1 and VO3. See Figure 22 and Figure 23.
The TPS6514x series has a regulated negative charge pump using two external Schottky diodes. The input voltage for the charge pump is applied to the SUP pin that is connected to the output of the main boost converter VO1. The charge pump inverts the main boost converter output voltage and is capable of supplying a minimum load current of 20 mA. Higher load currents are possible depending on the voltage difference between VO1 and VO2. See Figure 21.
The TPS6514x series includes a linear regulator controller to generate a 3.3-V rail which is useful when the system is powered from a 5-V supply. The regulator is independent from the other voltage rails of the device and has its own enable (ENR). Because most of the systems require this voltage rail to come up first, TI recommends using a R-C delay on EN. This delays the start-up of the main boost converter which reduces the inrush current as well.
The main boost converter as well as the charge pumps and linear regulator have an internal soft start. This avoids heavy voltage drops at the input voltage rail or at the output of the main boost converter VO1 during start-up. See Figure 19 and Figure 20. During soft start of the main boost converter VO1, the internal current limit threshold is increased in three steps. The device starts with the first step where the current limit is set to 2/5 of the typical current limit (2/5 of 2.3 A) for 1024 clock cycles then increased to 3/5 of the current limit for 1024 clock cycles and the 3rd step is the full current limit. The TPS65141 has an extended soft-start time where each step is 2048 clock cycles.
All of the outputs of the TPS65140 and TPS65145 have short-circuit detection and cause the device to go into shutdown. The TPS65141, as an exception, does not enter shutdown in case one of the outputs falls below its power good threshold. The main boost converter has overvoltage and undervoltage protection. If the output voltage VO1 rises above the overvoltage protection threshold of typically 5% of VO1, then the device stops switching, but remains operational. When the output voltage falls below this threshold, the converter continues operation. When the output voltage falls below the undervoltage protection threshold of typically 8.75% of VO1, because of a short-circuit condition, the TPS65140 and TPS65145 goes into shutdown. Because there is a direct pass from the input to the output through the diode, the short-circuit condition remains. If this condition must be avoided, a fuse at the input or an output disconnect using a single transistor and resistor is required. The negative and positive charge pumps have an undervoltage lockout (UVLO) to protect the LCD panel of possible latch-up conditions due to a short-circuit condition or faulty operation. When the negative output voltage is typically above 9.5% of its output voltage (closer to ground), then the device enters shutdown. When the positive charge pump output voltage, VO3, is below 8% typical of its output voltage, the device goes into shutdown. See the fault protection thresholds in Electrical Characteristics. The device is enabled by toggling the enable pin (EN) below 0.4 V or by cycling the input voltage below the UVLO of 1.7 V. The linear regulator reduces the output current to 20 mA typical under a short-circuit condition when the output voltage is typically < 1 V. See Functional Block Diagram. The linear regulator does not go into shutdown under a short-circuit condition.
A thermal shutdown is implemented to prevent damage due to excessive heat and power dissipation. Typically, the thermal shutdown threshold is 160°C. If this temperature is reached, the device goes into shutdown. The device can be enabled by toggling the enable pin to low and back to high or by cycling the input voltage to GND and back to VI again.
The TPS6514x turns on when the input voltage is higher than VUVLO and the enable pin EN is pulled to HIGH. The device goes into shutdown and all its function apart from the linear regulator are disabled if one of these conditions is present:
NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
The TPS6514x devices have been designed to provide the input supply voltages for the source drivers and gate drivers in LCD displays. Additionally, they include a linear regulator controller that can be used with an external transistor to provide a regulated 3.3-V output for the digital circuits for LCD panels powered by a 5-V supply rail.
Figure 3 shows a typical application circuit for a monitor display powered from a 5-V supply. It generates up to 350 mA at 15 V to power the source drivers, and 20 mA at 30 V and –12 V to power the gate drivers.
Table 1 shows the design parameters for this example.
PARAMETER | VALUE | |
---|---|---|
VI | Input supply voltage | 2.7 V to 5.8 V |
VO1 | Boost converter output voltage and current | Up to 15 V at 350 mA |
VO3 | Positive charge pump output voltage and current | Up to 30 V at 20 mA |
VO2 | Negative charge pump output voltage and current | Down to –12 V at 20 mA |
VO4 | Linear regulator controller output voltage and current | 3.3 V at 500 mA |
The first step in the design procedure is to calculate the maximum possible output current of the main boost converter under certain input and output voltage conditions. The following is an example for a 3.3-V to 10-V conversion:
VIN = 3.3 V, VOUT = 10 V, Switch voltage drop VSW = 0.5 V, Schottky diode forward voltage VD = 0.8 V
The integrated switch, the inductor, and the external Schottky diode must be able to handle the peak switch current. The calculated peak switch current must be equal to or lower than the minimum N-MOSFET switch current limit as specified in Electrical Characteristics (1.6 A for the TPS65140 and TPS65141 and 0.96 A for the TPS65145). If the peak switch current is higher, then the converter cannot support the required load current. This calculation must be done for the minimum input voltage where the peak switch current is highest. The calculation includes conduction losses like switch rDS(on) (0.5 V) and diode forward drop voltage losses (0.8 V). Additional switching losses, inductor core and winding losses, and so forth, require a slightly higher peak switch current in the actual application. The above calculation still allows for a good design and component selection.
Several inductors work with the TPS6514x. Especially with the external compensation, the performance can be adjusted to the specific application requirements. The main parameter for the inductor selection is the saturation current of the inductor which must be higher than the peak switch current as calculated above with additional margin to cover for heavy load transients and extreme start-up conditions. Another method is to choose the inductor with a saturation current at least as high as the minimum switch current limit of 1.6 A for the TPS65140 and TPS65141 and 0.96 A for the TPS65145. The different switch current limits allow selection of a physically smaller inductor when less output current is required. The second important parameter is the inductor DC resistance. Usually, the lower the DC resistance, the higher the efficiency. However, the inductor DC resistance is not the only parameter determining the efficiency. Especially for a boost converter where the inductor is the energy storage element, the type and material of the inductor influences the efficiency as well. Especially at high switching frequencies of 1.6 MHz, inductor core losses, proximity effects, and skin effects become more important. Usually, an inductor with a larger form factor yields higher efficiency. The efficiency difference between different inductors can vary from 2% to 10%. For the TPS6514x, inductor values from 3.3 µH to 6.8 µH are a good choice but other values can be used as well. Possible inductors are shown in Table 2.
DEVICE | INDUCTOR VALUE | COMPONENT SUPPLIER | DIMENSIONS / mm | ISAT/DCR |
---|---|---|---|---|
TPS65140 | 4.7 µH | Coilcraft DO1813P-472HC | 8.89 × 6.1 × 5 | 2.6 A, 54 mΩ |
4.2 µH | Sumida CDRH5D28 4R2 | 5.7 × 5.7 × 3 | 2.2 A, 23 mΩ | |
4.7 µH | Sumida CDC5D23 4R7 | 6 × 6 × 2.5 | 1.6 A, 48 mΩ | |
3.3 µH | Wuerth Elektronik 744042003 | 4.8 × 4.8 × 2 | 1.8 A, 65 mΩ | |
4.2 µH | Sumida CDRH6D12 4R2 | 6.5 × 6.5 × 1.5 | 1.8 A, 60 mΩ | |
3.3 µH | Sumida CDRH6D12 3R3 | 6.5 × 6.5 × 1.5 | 1.9 A, 50 mΩ | |
TPS65145 | 3.3 µH | Sumida CDPH4D19 3R3 | 5.1 × 5.1 × 2 | 1.5 A, 26 mΩ |
3.3 µH | Coilcraft DO1606T-332 | 6.5 × 5.2 × 2 | 1.4 A, 120 mΩ | |
3.3 µH | Sumida CDRH2D18/HP 3R3 | 3.2 × 3.2 × 2 | 1.45 A, 69 mΩ | |
4.7 µH | Wuerth Elektronik 744010004 | 5.5 × 3.5 × 1 | 1 A, 260 mΩ | |
3.3 µH | Coilcraft LPO6610-332M | 6.6 × 5.5 × 1 | 1.3 A, 160 mΩ |
For best output voltage filtering, TI recommends a low-ESR output capacitor. Ceramic capacitors have a low ESR value but depending on the application, tantalum capacitors can be used as well. A 22-µF ceramic output capacitor works for most of the applications. Higher capacitor values can be used to improve load transient regulation. See Table 2 for the selection of the output capacitor. The output voltage ripple can be calculated as:
where
For good input voltage filtering, TI recommends low-ESR ceramic capacitors. A 22-µF ceramic input capacitor is sufficient for most of applications. For better input voltage filtering, this value can be increased. See Table 3 and the typical applications for input capacitor recommendations.
CAPACITOR | VOLTAGE RATING | COMPONENT SUPPLIER | COMMENTS |
---|---|---|---|
22 µF, 1210 | 16 V | Taiyo Yuden EMK325BY226MM | CO |
22 µF, 1206 | 6.3 V | Taiyo Yuden JMK316BJ226 | CI |
To achieve high efficiency, a Schottky diode must be used. The voltage rating must be higher than the maximum output voltage of the converter. The average forward current must be equal to the average inductor current of the converter. The main parameter influencing the efficiency of the converter is the forward voltage and the reverse leakage current of the diode; both must be as low as possible. Possible diodes are: On Semiconductor MBRM120L, Microsemi UPS120E, and Fairchild Semiconductor MBRS130L.
The TPS6514x converter loop can be externally compensated and allows access to the internal transconductance error amplifier output at the COMP pin. A small feedforward capacitor across the upper feedback resistor divider speeds up the circuit as well. To test the converter stability and load transient performance of the converter, a load step from 50 mA to 250 mA is applied, and the output voltage of the converter is monitored. Applying load steps to the converter output is a good tool to judge the stability of such a boost converter.
The output voltage is set by the external resistor divider and is calculated as:
Across the upper resistor, a bypass capacitor is required to speed up the circuit during load transients as shown in Figure 4.
Together with R1 the bypass capacitor C8 sets a zero in the control loop at approximately 50 kHz:
A value closest to the calculated value must be used. Larger feedforward capacitor values reduce the load regulation of the converter and cause load steps as shown in Figure 5.
The regulator loop can be compensated by adjusting the external components connected to the COMP pin. The COMP pin is connected to the output of the internal transconductance error amplifier. A typical compensation scheme is shown in Figure 6.
The compensation capacitor CC adjusts the low frequency gain, and the resistor value adjusts the high frequency gain. The following formula calculates at what frequency the resistor increases the high frequency gain.
Lower input voltages require a higher gain and a lower compensation capacitor value. A good start is CC = 1 nF for a 3.3-V input and CC = 2.2 nF for a 5-V input. If the device operates over the entire input voltage range from 2.7 V to 5.8 V, TI recommends a larger compensation capacitor up to 10 nF. Figure 7 shows the load transient with a larger compensation capacitor, and Figure 8 shows a smaller compensation capacitor.
Lastly, RC must be selected. A good practice is to use a 50-kΩ potentiometer and adjust the potentiometer for the best load transient where no oscillations should occur. These tests have to be done at the highest VIN and highest load current because the converter stability is most critical under these conditions. Figure 9, Figure 10, and Figure 11 show the fine tuning of the loop with RC.
The negative charge pump provides a regulated output voltage by inverting the main output voltage, VO1. The negative charge pump output voltage is set with external feedback resistors.
The maximum load current of the negative charge pump depends on the voltage drop across the external Schottky diodes, the internal ON-resistance of the charge pump MOSFETS Q8 and Q9, and the impedance of the flying capacitor, C12. When the voltage drop across these components is larger than the voltage difference from VO1 to VO2, the charge pump is in drop out, providing the maximum possible output current. Therefore, the higher the voltage difference between VO1 and VO2, the higher the possible load current. See Figure 21 for the possible output current versus boost converter voltage VO1 and the calculations below.
Setting the output voltage:
The lower feedback resistor value, R4, must be in a range from 40 kΩ to 120 kΩ or the overall feedback resistance must be within 500 kΩ to 1 MΩ. Smaller values load the reference too heavy and larger values may cause stability problems. The negative charge pump requires two external Schottky diodes. The peak current rating of the Schottky diode must be twice the load current of the output. For a 20-mA output current, the dual Schottky diode BAT54 or similar is a good choice.
The positive charge pump can be operated in a voltage doubler mode or a voltage tripler mode depending on the configuration of the C2+ and C2–/MODE pins. Leaving the C2+ pin open and connecting C2-/MODE to GND forces the positive charge pump to operate in a voltage doubler mode. If higher output voltages are required the positive charge pump can be operated as a voltage tripler. To operate the charge pump in the voltage tripler mode, a flying capacitor must be connected to C2+ and C2–/MODE.
The maximum load current of the positive charge pump depends on the voltage drop across the internal Schottky diodes, the internal ON-resistance of the charge pump MOSFETS, and the impedance of the flying capacitor. When the voltage drop across these components is larger than the voltage difference VO1 × 2 to VO3 (doubler mode) or VO1 × 3 to VO3 (tripler mode), then the charge pump is in dropout, providing the maximum possible output current. Therefore, the higher the voltage difference between VO1 x 2 (doubler) or VO1 × 3 (tripler) to VO3, the higher the possible load current. See Figure 22 and Figure 23 for output current versus boost converter voltage, VO1, and the following calculations.
Voltage doubler:
Voltage tripler:
The output voltage is set by the external resistor divider and is calculated as:
The TPS6514x includes a linear regulator controller to generate a 3.3-V rail when the system is powered from a 5-V supply. Because an external NPN transistor is required, the input voltage of the TPS6514x applied to VIN must be higher than the output voltage of the regulator. To provide a minimum base drive current of 13.5 mA, a minimum internal voltage drop of 500 mV from VI to VBASE is required. This can be translated into a minimum input voltage on VIN for a certain output voltage as the following calculation shows:
The base drive current together with the hFE of the external transistor determines the possible output current. Using a standard NPN transistor like the BCP68 allows an output current of 1 A and using the BCP54 allows a load current of 337 mA for an input voltage of 5 V. Other transistors can be used as well, depending on the required output current, power dissipation, and PCB space. The device is stable with a 4.7-µF ceramic output capacitor. Larger output capacitor values can be used to improve the load transient response when higher load currents are required.
The TPS6514x devices are designed to operate from an input voltage supply range from 2.7 V to 5.8 V. This input supply must be well regulated. The input capacitance shown in the application schematics in this data sheet is sufficient for typical applications.
For all switching power supplies, the layout is an important step in the design, especially at high-peak currents and switching frequencies. If the layout is not carefully designed, the regulator might show stability and EMI problems. TI recommends the following PCB layout guidelines for the TPS6514x devices:
An influential component of the thermal performance of a package is board design. To take full advantage of the heat dissipation abilities of the PowerPAD or VQFN package with exposed thermal die, a board that acts similar to a heatsink and allows for the use of an exposed (and solderable) deep downset pad must be used. For further information, see Texas Instruments application notes PowerPAD Thermally Enhanced Package and Power Pad Made Easy. For the VQFN package, see the application report QFN/SON PCB Attachement. Especially for the VQFN package, it is required to solder down the thermal pad to achieve the required thermal resistance.
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For related documentation see the following:
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.
PARTS | PRODUCT FOLDER | SAMPLE & BUY | TECHNICAL DOCUMENTS | TOOLS & SOFTWARE | SUPPORT & COMMUNITY |
---|---|---|---|---|---|
TPS65140 | Click here | Click here | Click here | Click here | Click here |
TPS65141 | Click here | Click here | Click here | Click here | Click here |
TPS65145 | Click here | Click here | Click here | Click here | Click here |
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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