SLVSB16E November   2011  – December 2015 TPS43340-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable Inputs
      2. 7.3.2 Linear Regulator (LREG1)
      3. 7.3.3 Gate-Driver Supply (VREG, EXTSUP)
      4. 7.3.4 External P-Channel Drive (GPULL) and Reverse Battery Protection
      5. 7.3.5 Undervoltage Lockout and Overvoltage Protection
      6. 7.3.6 Synchronous Buck Converter Buck3
        1. 7.3.6.1 Soft Start and Foldback Functions
        2. 7.3.6.2 Current-Mode Control and Current-Limit Protection
        3. 7.3.6.3 Operation in Dropout and Undervoltage Protection
        4. 7.3.6.4 Slew Rate Control (SLEW)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Buck Controllers: Normal Mode PWM Operation
        1. 7.4.1.1 Setting the Operating Frequency
        2. 7.4.1.2 Feedback Inputs
        3. 7.4.1.3 Soft-Start Inputs
        4. 7.4.1.4 Current-Mode Operation
        5. 7.4.1.5 Current Sensing and Current Limit With Foldback
        6. 7.4.1.6 Slope Compensation
        7. 7.4.1.7 Reset Outputs and Filter Delays
        8. 7.4.1.8 Light-Load PFM Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High- and Low-Side Power NMOS Selection for the Buck Converters
        2. 8.2.2.2 Buck1 Component Selection
        3. 8.2.2.3 Buck2 Component Selection
        4. 8.2.2.4 Buck3 Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
      1. 10.3.1 Power Dissipation of Buck1 and Buck2 (VOUT1 and VOUT2)
      2. 10.3.2 Power Dissipation of Buck Converter Buck3 (VOUT3)
        1. 10.3.2.1 High-Side Switch
        2. 10.3.2.2 Low-Side Switch
        3. 10.3.2.3 Linear Regulator (LREG1)
        4. 10.3.2.4 IC Power Consumption
    4. 10.4 Thermal Considerations
      1. 10.4.1 Phase Configuration
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

TPS4334xEVM Evaluation Module, SLVU463

TPS43340-Q1 Family Design Checklist, SLVA614

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.