SLVSBD0B November   2012  – June 2020 TPS2553-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application as USB Power Switch
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overcurrent Conditions
      2. 8.3.2 Reverse-Voltage Protection
      3. 8.3.3 FAULT Response
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Enable (EN)
      6. 8.3.6 Thermal Sense
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Programming the Current-Limit Threshold
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Constant-Current and Impact on Output Voltage
      2. 9.1.2 Accounting for Resistor Tolerance
      3. 9.1.3 Input and Output Capacitance
    2. 9.2 Typical Applications
      1. 9.2.1 Application 1: Designing Above a Minimum Current-Limit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Application 2: Designing Below a Maximum Current-Limit
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application 3: Auto-Retry Functionality
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
      4. 9.2.4 Application 4: Two-Level Current-Limit Circuit
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
      5. 9.2.5 Application 5: Typical Application as USB Power Switch
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
          1. 9.2.5.2.1 Universal Serial Bus (USB) Power-Distribution Requirements
  10. 10Power Supply Recommendations
    1. 10.1 USB Self-Powered (SPH) and Bus-Powered (BPH) Hubs
    2. 10.2 USB Low-Power Bus-Powered and High-Power Bus-Powered Functions
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation and Junction Temperature
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Support Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

9.1.3 Input and Output Capacitance

Input and output capacitance improves the performance of the device; the actual capacitance should be optimized for the particular application. For all applications, a 0.1 μF or greater ceramic bypass capacitor between IN and GND is recommended to be as close to the device as possible for local noise de-coupling. This precaution reduces ringing on the input due to power-supply transients. Additional input capacitance may be needed on the input to reduce voltage overshoot from exceeding the absolute maximum voltage of the device during heavy-transient conditions. This is especially important during bench testing when long, inductive cables are used to connect the evaluation board to the bench power-supply.

TI recommends placing a high-value electrolytic capacitor on the output pin when large transient currents are expected on the output.