SLVSEN9D April   2019  – July 2022

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Comparison
      2. 7.3.2  Analog Inputs
        1. 7.3.2.1 Analog Input Protection
        2. 7.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.2.3 Analog Input Offset Adjust
      3. 7.3.3  ADC Core
        1. 7.3.3.1 ADC Theory of Operation
        2. 7.3.3.2 ADC Core Calibration
        3. 7.3.3.3 Analog Reference Voltage
        4. 7.3.3.4 ADC Overrange Detection
        5. 7.3.3.5 Code Error Rate (CER)
      4. 7.3.4  Temperature Monitoring Diode
      5. 7.3.5  Timestamp
      6. 7.3.6  Clocking
        1. 7.3.6.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.6.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.6.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.6.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.6.3.2 Automatic SYSREF Calibration
      7. 7.3.7  Programmable FIR Filter (PFIR)
        1. 7.3.7.1 Dual Channel Equalization
        2. 7.3.7.2 Single Channel Equalization
        3. 7.3.7.3 Time Varying Filter
      8. 7.3.8  Digital Down Converters (DDC)
        1. 7.3.8.1 Rounding and Saturation
        2. 7.3.8.2 Numerically-Controlled Oscillator and Complex Mixer
          1. 7.3.8.2.1 NCO Fast Frequency Hopping (FFH)
          2. 7.3.8.2.2 NCO Selection
          3. 7.3.8.2.3 Basic NCO Frequency Setting Mode
          4. 7.3.8.2.4 Rational NCO Frequency Setting Mode
          5. 7.3.8.2.5 NCO Phase Offset Setting
          6. 7.3.8.2.6 NCO Phase Synchronization
        3. 7.3.8.3 Decimation Filters
        4. 7.3.8.4 Output Data Format
        5. 7.3.8.5 Decimation Settings
          1. 7.3.8.5.1 Decimation Factor
          2. 7.3.8.5.2 DDC Gain Boost
      9. 7.3.9  JESD204C Interface
        1. 7.3.9.1 Transport Layer
        2. 7.3.9.2 Scrambler
        3. 7.3.9.3 Link Layer
        4. 7.3.9.4 8B/10B Link Layer
          1. 7.3.9.4.1 Data Encoding (8B/10B)
          2. 7.3.9.4.2 Multiframes and the Local Multiframe Clock (LMFC)
          3. 7.3.9.4.3 Code Group Synchronization (CGS)
          4. 7.3.9.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 7.3.9.4.5 Frame and Multiframe Monitoring
        5. 7.3.9.5 64B/66B Link Layer
          1. 7.3.9.5.1 64B/66B Encoding
          2. 7.3.9.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
          3. 7.3.9.5.3 Block, Multiblock and Extended Multiblock Alignment using Sync Header
            1. 7.3.9.5.3.1 Cyclic Redundancy Check (CRC) Mode
            2. 7.3.9.5.3.2 Forward Error Correction (FEC) Mode
          4. 7.3.9.5.4 Initial Lane Alignment
          5. 7.3.9.5.5 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 7.3.9.6 Physical Layer
          1. 7.3.9.6.1 SerDes Pre-Emphasis
        7. 7.3.9.7 JESD204C Enable
        8. 7.3.9.8 Multi-Device Synchronization and Deterministic Latency
        9. 7.3.9.9 Operation in Subclass 0 Systems
      10. 7.3.10 Alarm Monitoring
        1. 7.3.10.1 Clock Upset Detection
        2. 7.3.10.2 FIFO Upset Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode
      2. 7.4.2 Single-Channel Mode (DES Mode)
      3. 7.4.3 Dual-Input Single-Channel Mode (DUAL DES Mode)
      4. 7.4.4 JESD204C Modes
        1. 7.4.4.1 JESD204C Operating Modes Table
        2. 7.4.4.2 JESD204C Modes continued
        3. 7.4.4.3 JESD204C Transport Layer Data Formats
        4. 7.4.4.4 64B/66B Sync Header Stream Configuration
      5. 7.4.5 Power-Down Modes
      6. 7.4.6 Test Modes
        1. 7.4.6.1 Serializer Test-Mode Details
        2. 7.4.6.2 PRBS Test Modes
        3. 7.4.6.3 Clock Pattern Mode
        4. 7.4.6.4 Ramp Test Mode
        5. 7.4.6.5 Short and Long Transport Test Mode
          1. 7.4.6.5.1 Short Transport Test Pattern
        6. 7.4.6.6 D21.5 Test Mode
        7. 7.4.6.7 K28.5 Test Mode
        8. 7.4.6.8 Repeated ILA Test Mode
        9. 7.4.6.9 Modified RPAT Test Mode
      7. 7.4.7 Calibration Modes and Trimming
        1. 7.4.7.1 Foreground Calibration Mode
        2. 7.4.7.2 Background Calibration Mode
        3. 7.4.7.3 Low-Power Background Calibration (LPBG) Mode
      8. 7.4.8 Offset Calibration
      9. 7.4.9 Trimming
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Streaming Mode
    6. 7.6 SPI Register Map
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband RF Sampling Receiver
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calculating Values of AC-Coupling Capacitors
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Reconfigurable Dual-Channel 5-GSPS or Single-Channel 10-Gsps Oscilloscope
        1. 8.2.2.1 Design Requirements
          1. 8.2.2.1.1 Input Signal Path
          2. 8.2.2.1.2 Clocking
          3. 8.2.2.1.3 ADC12DJ5200RF
        2. 8.2.2.2 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
    1. 9.1 Power Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 145
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
7.3.9.5.4 Initial Lane Alignment

The 64B/66B link layer does not use an initial lane alignment sequence (ILAS) like the 8B/10B link layer. Therefore, the receiver must use a different scheme to align lanes using the elastic buffer. In 8B/10B mode, the ILAS triggers the elastic buffer to start buffering the data for each lane. After all lanes have started buffering the data, the elastic buffers for each lane are released at a release point determined by the release buffer delay (RBD) parameter and the phase of the LMFC. In 64B/66B mode, the process starts by having all lanes achieve block, multiblock and extended multiblock alignment. Once all lanes have achieved alignment, the receiver can begin buffering data in the elastic buffers at the start of the next extended multiblock on each lane. The data is released at the next release point after all lanes have seen the start of an extended multiblock and have started buffering the data. The release point is defined relative to the LEMC edge and the programmed RBD value, the most intuitive of which is to release on the LEMC edge itself. The release point must be chosen to avoid the region of the LEMC containing variation in the data delay on each lane from startup to startup.