SLVU189B february   2007  – may 2023 TPS74701 , TPS74801

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Performance Specification Summary
    2. 1.2 Modifications
  5. 2Input and Output Connector Descriptions
    1. 2.1  J1–VIN/GND
    2. 2.2  J2–GND
    3. 2.3  J3–VIN
    4. 2.4  J4–VBIAS
    5. 2.5  J5–GND
    6. 2.6  J6–VOUT
    7. 2.7  J7–GND
    8. 2.8  J8–VOUT/GND
    9. 2.9  J10–EN
    10. 2.10 J11–GND
    11. 2.11 J12-VIN/GND
    12. 2.12 J13-VOUT/GND
    13. 2.13 JP1–1 ms/Simult Versus 10 ms/Ratio
    14. 2.14 S1
    15. 2.15 TP1
    16. 2.16 TP2
    17. 2.17 TP3
    18. 2.18 TP4
  6. 3Test Setup
  7. 4Test Results
  8. 5Board Layout
  9. 6Bill of Materials and Schematic
    1. 6.1 Schematic Drawing
  10. 7Revision History

1.2 Modifications

The TPS74x01EVM-177 board is designed with devices having 0603 or larger footprint to aid user customization of the EVM. A real implementation can occupy less total board space.

Changing components can improve or degrade EVM performance. For example, adding a larger output capacitor reduces output voltage undershoot but lengthens response time after a load transient event. Inductive leads from the VIN pin power supply can cause droop during a load transient. Adding a larger input capacitor reduces droop at the VIN pin.