SLVUBV4A December   2020  – December 2021 TPS272C45

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 Compatibility Across Silicon Versions
  4. 3 BoosterPack Operation
  5. 4 TPS272C45EVM Schematic
  6. 5 Connection Descriptions
  7. 6 TPS272C45EVM Assembly Drawings and Layout
  8. 7 Current Limit Configuration
  9. 8 Current Sense
  10. 9 Transient Protection
  11. 10Bill of Materials
  12. 11Revision History

1 Introduction

The Texas Instruments TPS272C45EVM is an evaluation module that is used to demonstrate and showcase all of the features of the underlying TPS272C45 industrial high side switch. This evaluation board provides a seamless way to connect a set of power supplies to the inputs of the TPS272C45, connect loads to the output channels, and switch on and off the device using the control pins of the chip itself. An on-board 3.3-V LDO is included on the EVM to simplify controlling signals to the TPS272C45 and easily assert and deassert logic signals by the use of a set of external hardware jumpers. Additionally this EVM includes BoosterPack headers allowing the user to easily connect the TPS272C45 high side switch to an underlying microcontroller and write software to control and configure the device.

Features of the TPS272C45EVM include:

  • Multiplexed current limit configuration on ILIM1
  • BoosterPack headers allowing power switch to be controlled by external microcontroller
  • On-board 3.3-V LDO allowing for control signals to be manipulated by set of jumpers
  • Ideal board layout and copper area for thermal performance
  • Ability to support versions A, B, C, and D of the TPS272C45
  • Optional footprint to populate external inductive clamping diodes (version C of TPS272C45)
  • Optional footprint to populate TVS diode for Vdd input (version A of TPS272C45)