SLVUCX9A May   2024  – May 2024 TPS7H1121-SP

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Connector Descriptions
    2. 2.2 Best Practices
  7. 3Implementation Results
    1. 3.1 Soft Start
    2. 3.2 Shutdown
    3. 3.3 Current Limit
    4. 3.4 Frequency Response
    5. 3.5 PSRR
    6. 3.6 Noise Spectral Density
  8. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Compliance Information
  10. 6Additional Information
    1. 6.1 Trademarks
  11. 7Related Documentation
  12. 8Revision History

PCB Layouts

TPS7H1121EVM-CVAL Top OverlayFigure 4-2 Top Overlay
TPS7H1121EVM-CVAL Layer 1 (Top)Figure 4-4 Layer 1 (Top)
TPS7H1121EVM-CVAL Layer 3Figure 4-6 Layer 3
TPS7H1121EVM-CVAL Bottom Solder MaskFigure 4-8 Bottom Solder Mask
TPS7H1121EVM-CVAL Drill DrawingFigure 4-10 Drill Drawing
TPS7H1121EVM-CVAL Top Solder MaskFigure 4-3 Top Solder Mask
TPS7H1121EVM-CVAL Layer 2Figure 4-5 Layer 2
TPS7H1121EVM-CVAL Layer 3 (Bottom)Figure 4-7 Layer 3 (Bottom)
TPS7H1121EVM-CVAL Bottom OverlayFigure 4-9 Bottom Overlay