SNAA402 April 2024 LMX2820
High Frequency Clock(>20GHz) Skew variation between two RF Synthesizer(LMX2820) across temperature is evaluated. In general, one time adjustment is done at room temperature using MASH_SEED option in LMX2820, if needed. But the clock skew should not vary across temperature such that timing issues like setup violation can be avoided. This is particularly critical at high clock frequency where clock period is less and margin for the variation is less. Board containing two LMX2820s mentioned in TIDA-010230 is used for evaluating the variation in clock to clock skew across temperature. Block level diagram of test setup is shown in Figure 1.
High Sampling scope used for this evaluation is DSO-X 93304Q (Agilent Technologies Digital Storage Oscilloscope which has 33GHz BW and 80GSa/s). LMK04832 is used for syncing both LMX2820. Initial Clk-Clk skew between two LMX2820 depends on the doubler calibration settings, if doubler is engaged.
Table 1 summarizes the Clk-Clk skew at room temperature if doubler calibration settings are different between two LMX2820s. Traces from LMX2820_A and LMX2820_B till the scope input is matched for this measurement. Table 1 is taken when doubler is engaged at the output. There is uncertainty of 0.6ps in measurement due to scope noise.
S. No | CLK-CLK Delta (delta delay in ps) | 2820_A Pregen captrim | 2820_B Pregen captrim | 2820_A Amp captrim | 2820_B Amp captrim |
---|---|---|---|---|---|
1 | 8.96 | 1 | 1 | 0 | 0 |
2 | 16.86 | 2 | 1 | 0 | 0 |
3 | 23.1 | 3 | 1 | 0 | 0 |
4 | 28.4 | 4 | 1 | 0 | 0 |
5 | 21 | 1 | 1 | 1 | 0 |
6 | 32 | 1 | 1 | 2 | 0 |
Figure 2 shows the Oscilloscope measurement at 22.16GHz as output frequency for LMX2820_A and LMX2820_B.
Table 2 summarizes the Clk-Clk skew variation when temperature varies for LMX2820.
Case | 2820_A_TEMP_SENS_RD/ 2820_B_TEMP_SENS_RD | Temp_2820_A (degree C)--> Temp Sensor Reading | Temp_2820_B (degree C)-->Temp Sensor Reading | CLK-CLK Delay | Ambient Thermostream |
---|---|---|---|---|---|
1 | 624/619 | 83.928 | 81.068 | 2.9ps | 25 deg (Room temp) |
2 | 760/774 | 161.72 | 169.728 | -1ps | Hot temp |
3 | 553/538 | 43.316 | 34.736 | 3.5ps | Cold temp |
Internal temperature of the die is read using temperature sensor present on chip, and conversion formula is used to evaluate the temperature.
Delay Variation seen is less than 5ps across temperature between two LMX2820s across temperature.