The HDC3020EVM can be broken into 2 sections to isolate the thermal mass of the μC from the HDC3020. Figure 3-3 shows the board perforations where the two sections can break apart.

Figure 3-3 PC Interface and Sensor Module.

The purpose of the header connector is to isolate the heat source from the HDC3020. When the HDC3020 is separated from the MSP430, it can be connected through wires or headers on both ends for remote temperature and humidity measurements. In this configuration, the thermal mass is reduced, improving the temperature measurements of the device. The GUI can still be used to communicate with the sensor and collect data.

Figure 3-4 PC Interface and Smaller Sensor Module.

Alternatively it is possible to connect the sensor module to a custom microcontroller.

Figure 3-5 Bottom Layer of the HDC3020EVM.