SNIA053 june   2023 TMP61-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Heat Sink Temperature Sensor Monitoring
  5. 2Test Overview
    1. 2.1 Hardware
      1. 2.1.1 Keysight E3631A Power Supply
      2. 2.1.2 Sorensen DCS 40-25E Programmable DC Power Supply
      3. 2.1.3 B&K Precision 8500 DC Electronic Load
      4. 2.1.4 TDS3014B Tektronix Digital Oscilloscope
      5. 2.1.5 Fluke TiS60+ Thermal Imager
      6. 2.1.6 MSP430F5529LP LaunchPad
    2. 2.2 Isolated Gate Driver
    3. 2.3 IGBT Module
    4. 2.4 NTC Ring Lug
    5. 2.5 TMP6 Ring Lug
    6. 2.6 Schematic
  6. 3Test Implementation
    1. 3.1 Data Collected
    2. 3.2 Test Results
  7. 4Design Recommendations
    1. 4.1 Ring Lugs for the TMP6
    2. 4.2 Thermal Epoxy
  8. 5Summary
  9. 6References

2.1.6 MSP430F5529LP LaunchPad

The MSP430F5529LP LaunchPad™ microcontroller is an inexpensive and simple development kit for the MSP430F5529 USB Microcontroller. The development kit offers an easy method to start developing on the MSP430™ MCU, with onboard emulation for programming and debugging as well as buttons and LEDs for a simple user interface. The MSP430 LaunchPad™ development kit provides a PWM signal to the IGBT gate driver and for data collection of thermistors on the analog inputs of the microcontroller.

GUID-275B62F0-41AB-427E-A8F7-8F2E3F9C22E4-low.jpg Figure 2-7 MSP430F5529LP LaunchPad™ Microcontroller