SNIA053 june   2023 TMP61-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Heat Sink Temperature Sensor Monitoring
  5. 2Test Overview
    1. 2.1 Hardware
      1. 2.1.1 Keysight E3631A Power Supply
      2. 2.1.2 Sorensen DCS 40-25E Programmable DC Power Supply
      3. 2.1.3 B&K Precision 8500 DC Electronic Load
      4. 2.1.4 TDS3014B Tektronix Digital Oscilloscope
      5. 2.1.5 Fluke TiS60+ Thermal Imager
      6. 2.1.6 MSP430F5529LP LaunchPad
    2. 2.2 Isolated Gate Driver
    3. 2.3 IGBT Module
    4. 2.4 NTC Ring Lug
    5. 2.5 TMP6 Ring Lug
    6. 2.6 Schematic
  6. 3Test Implementation
    1. 3.1 Data Collected
    2. 3.2 Test Results
  7. 4Design Recommendations
    1. 4.1 Ring Lugs for the TMP6
    2. 4.2 Thermal Epoxy
  8. 5Summary
  9. 6References

2.3 IGBT Module

The Infineon FF400R07A01E3_S6 IGBT half-bridge module is a compact half-bridge module for hybrid and electric vehicle applications. The FF400R07A01E3_S6 module is designed for Double Sided Cooling (DSC). The FF400R07A01E3_S6 operates up to 150°C with limited operation up to 175°C. The module is rated for up to 700 V and 400 A with a maximum power dissipation of 1500 W. The gate thresholds have a typical value of 5.80 V.