Abstract

In emerging technologies such as AR/VR headsets, achieving fast thermal response times and high accuracy can help optimize performance, safety, and user experience. Fast thermal response times minimize the delay between actual and measured temperatures, which is essential in environments where immediate reaction to temperature changes is necessary to prevent system failures and enhance reliability.

This application note examines the thermal response characteristics of the TMP116 (0.20°C accuracy), TMP117 (0.10°C accuracy), and TMP119 (0.08°C accuracy) temperature sensors. The application note highlights the impact of package selection and PCB design on thermal performance. Sensors with lower thermal mass, like the TMP117, in the DSBGA package, offer a faster thermal response times compared to those in WSON/QFN packages, due to the reduction the IC thermal mass. Achieving real-time precise surface temperature measurements in various applications, it is important to have minimal thermal resistance between the measured object surface and the sensor package. High thermal resistance can lead to sensor temperature shift from the measured object, as well as a delayed thermal response time.

This application note provides information about thermal resistance measurements made for different kinds of sensor packages mounted on varying thicknesses of rigid PCB, as well as flexible PCB. Flexible PCB, with reduced thermal mass, demonstrate significant advantages in settling time, achieving quicker and more accurate temperature readings.