SNOAA47A September   2024  – October 2024 TMP116 , TMP117 , TMP119

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Sensor - Object Surface Thermal Resistance and the Importance for Measurement Precision
  6. 3Testing
    1. 3.1 Hardware Setup
    2. 3.2 Test Setup
    3. 3.3 Test Method
      1. 3.3.1 Measurement Results
  7. 4Thermal Parameters Calculations
  8. 5Summarizing and Interpreting Test Results
  9. 6Summary
  10. 7References
  11. 8Revision History

3.3 Test Method

The coupon board attached to the thermal head was kept in a closed test chamber until DUT temperature readings stabilized. Once this steady state condition was reached, the following steps outline the test procedure:

  1. Initial Setup
    • The device is powered up, and the supply is set at 3V. The DUT is placed into continuous conversion mode. Throughout the entire procedure, temperature data is continuously collected, and DUT supply current is continually measured.
  2. Voltage Step-Up
    • After 15 seconds, the supply voltage is stepped up to 5.5V. The I2C bus voltage remains at 3V. This step uses the device digital input cells to consume additional current while the input level is 3V but the supply is 5.5V. This leads to significant sensor self-heating, which can be avoided during normal measurements.
  3. Voltage Step-Down
    • After 15 seconds, the supply voltage is stepped back down to 3V.