SNOK011 September 2024 TLV3603-EP
| Technology Family FIT / MTBF Data |
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| Mean Time Between Fails (MTBF) and Failures in Time
(FIT) rates are device reliability statistics calculated based on
data collected from TI’s internal reliability testing (life test).
TI’s DPPM/FIT/MTBF Estimator Search Tool reports the generic data based on technology groupings and shows conditions under which the rates were derived. All terms used in the tool and definitions can be found on the TI reliability terminology page. Failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested, therefore, it is not recommended to compare failure rates. |
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TI DPPM/FIT/MTBF Estimator Search Tool webpage link: |
| Device Family Qualification Data |
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TI’s Qualification Summary Search Tool reports generic qualification data representative of the material sets, processes, and manufacturing sites used by the device family and may not include all of the testing performed for a specific EP device. Please see the Enhanced Products New Device Qualification Matrix above for the full suite of qualification testing performed to release Enhanced Product devices. |
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TI Qualification Summary Search webpage link: |
| Ongoing Reliability Monitoring |
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TI periodically monitors the reliability of its products, wafer fab processes, and package technologies, through its Ongoing Reliability Monitor (ORM) program. The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report. |
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TI Ongoing Reliability Monitoring Search webpage link: |
For additional information or technical support please contact the Texas Instruments Customer Support Center at www.ti.com/csc For more information on TI Enhanced Products please visit www.ti.com/ep