SNOU198 October   2023 TLV3802

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Recommended Equipment Setup
    2. 2.2 Board Setup
      1. 2.2.1 Power Supplies
      2. 2.2.2 Inputs
      3. 2.2.3 Outputs
      4. 2.2.4 Hysteresis
    3. 2.3 Quick-Start Procedure
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials
  8. 4Additional Information
    1.     Trademarks

PCB Layouts

GUID-20230830-SS0I-S0KN-XZQX-9T7GVCLMBBZH-low.pngFigure 3-2 Top Layer
GUID-20231013-SS0I-GTCT-8DZB-ZFJJQCSJS2K3-low.pngFigure 3-4 GND-2
GUID-20231013-SS0I-7BWK-XZKX-2RV74FBF8WMZ-low.pngFigure 3-3 GND-1
GUID-20231013-SS0I-NZCV-89KQ-MFBSNTNLNCLQ-low.pngFigure 3-5 Bottom Layer