SNVA853C December   2019  – March 2024 LMZ10500 , LMZ10501 , LMZ20501 , LMZ20502 , LMZ21700 , LMZ21701 , LMZ30604 , LMZ31506 , LMZ31520 , LMZ31530 , LMZ31704 , LMZ31707 , LMZ31710 , LMZ34202 , LMZ35003 , LMZ36002 , LMZM23600 , LMZM23601 , LMZM33602 , LMZM33603 , LMZM33604 , LMZM33606 , TLVM13610 , TLVM13630 , TLVM13640 , TLVM13660 , TLVM23615 , TLVM23625 , TPS82085 , TPS82130 , TPSM265R1 , TPSM33615 , TPSM33625 , TPSM365R3 , TPSM365R6 , TPSM53604 , TPSM5601R5 , TPSM5601R5H , TPSM5601R5HE , TPSM560R6 , TPSM63603 , TPSM63604 , TPSM63606 , TPSM63608 , TPSM63610 , TPSM84424 , TPSM84624 , TPSM846C23 , TPSM846C24 , TPSM84824

1.   1
2.   Abstract
3.   Trademarks
4. 1Introduction
5. 2Package Types
   1. 2.1 MicroSiP
   2. 2.2 QFN Overmolded
   3. 2.3 QFN Open Frame
   4. 2.4 Leaded
   5. 2.5 QFN-FCMOD
6. 3Package CAD/CAE Symbols and Footprints
7. 4Soldering
   1. 4.1 MSL Ratings
   2. 4.2 Reflow Profile
   3. 4.3 Back Side PCB Mounting Considerations
      1. 4.3.1 Method 1 - Solder Surface Perimeter
      2. 4.3.2 Method 2 - Solder Surface Area
      3. 4.3.3 Back Side PCB Mounting Evaluation of TI Modules
      4. 4.3.4 Reflow Fixture
8. 5Rework During Prototyping
9. 6References
10. 7Revision History