SNVSB35C May   2018  – November 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics Per Buck
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Soft Start
      2. 6.3.2 Power Good
      3. 6.3.3 Precision Enable
    4. 6.4 Device Functional Modes
      1. 6.4.1 Output Overvoltage Protection
      2. 6.4.2 Undervoltage Lockout
      3. 6.4.3 Current Limit
      4. 6.4.4 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Programming Output Voltage
      2. 7.1.2 VINC Filtering Components
      3. 7.1.3 Using Precision Enable and Power Good
      4. 7.1.4 Overcurrent Protection for HTSSOP-20 Package
      5. 7.1.5 Current Limit and Short-Circuit Protection for WQFN-16 Package
    2. 7.2 Typical Applications
      1. 7.2.1 2.2-MHz, 0.8-V Typical High-Efficiency Application Circuit
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 7.2.1.2.2 Inductor Selection
          3. 7.2.1.2.3 Input Capacitor Selection
          4. 7.2.1.2.4 Output Capacitor
          5. 7.2.1.2.5 Calculating Efficiency and Junction Temperature
        3. 7.2.1.3 Application Curves
      2. 7.2.2 2.2-MHz, 1.8-V Typical High-Efficiency Application Circuit
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
      3. 7.2.3 LM26420-Q12.2-MHz, 2.5-V Typical High-Efficiency Application Circuit
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Recommendations - HTSSOP-20 Package
      2. 7.3.2 Power Supply Recommendations - WQFN-16 Package
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 Method 1: Silicon Junction Temperature Determination
        2. 7.4.3.2 Thermal Shutdown Temperature Determination
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LM26420-Q1 UNIT
PWP (HTSSOP) RUM (WQFN)
20 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 38.5 36.2 °C/W
RθJC(top) Junction-to-case thermal resistance 21.0 32.7 °C/W
RθJB Junction-to-board thermal resistance 19.9 14.1 °C/W
ψJT Junction-to-top characterization parameter 0.7 0.3 °C/W
ψJB Junction-to-board characterization parameter 19.7 14.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5 4.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.