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The TPSM8290x are synchronous, step-down converter modules in a small 3.0-mm × 2.8-mm × 1.6-mm MicroSiP package. Three different devices in this family support 1 A, 2 A, or 3 A of output current.
Table 1-1, Table 1-2, and Table 1-3 provide a summary of the TPSM8290xEVM performance specifications.
Specification | Test Conditions | MIN | TYP | MAX | Unit |
---|---|---|---|---|---|
Input voltage | 3 | 12 | 17 | V | |
Output voltage setpoint | 1.2 | V | |||
Output current | 0 | 3 | A | ||
MODE/S-CONF (R7) setting | 2.5 MHz, auto PFM/PWM with AEE, external FB, output discharge disabled | 7.15 | kΩ |
Specification | Test Conditions | MIN | TYP | MAX | Unit |
---|---|---|---|---|---|
Input voltage | 3 | 12 | 17 | V | |
Output voltage setpoint | 1.8 | V | |||
Output current | 0 | 2 | A | ||
MODE/S-CONF (R7) setting | 2.5 MHz, auto PFM/PWM with AEE, external FB, output discharge disabled | 7.15 | kΩ |
Specification | Test Conditions | MIN | TYP | MAX | Unit |
---|---|---|---|---|---|
Input voltage | 3.4 | 12 | 17 | V | |
Output voltage setpoint | 3.3 | V | |||
Output current | 0 | 1 | A | ||
MODE/S-CONF (R7) setting | 2.5 MHz, auto PFM/PWM with AEE, external FB, output discharge disabled | 7.15 | kΩ |
The printed-circuit board (PCB) for this EVM is designed to accommodate some modifications by the user. Additionally, the following modifications can be made:
See the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter Module in a MicroSiP Package with an Integrated Inductor Data Sheet for details of the various settings.
C2, C3, and C4 are provided for additional input capacitors. These capacitors are not required for proper operation but can be used to reduce the input voltage ripple.
C7, C8, C9, and C10 are provided for additional bulk output capacitors. These capacitors are not required for proper operation but can be used to reduce the output voltage ripple. The total output capacitance must remain within the recommended range in the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter Module in a MicroSiPTM Package with an Integrated Inductor Data Sheet for proper operation.