SNVU820 February   2022

 

  1.   Trademarks
  2. 1High Density EVM Description
    1. 1.1 Typical Applications
    2. 1.2 Features and Electrical Performance
  3. 2EVM Characteristics
  4. 3Application Circuit Diagram
  5. 4EVM Photo
  6. 5Test Setup and Procedure
    1. 5.1 EVM Connections
    2. 5.2 Test Equipment
    3. 5.3 Recommended Test Setup
      1. 5.3.1 Input Connections
      2. 5.3.2 Output Connections
    4. 5.4 Test Procedure
      1. 5.4.1 Line and Load Regulation, Efficiency
  7. 6Test Data and Performance Curves
    1. 6.1 Conversion Efficiency
    2. 6.2 Operating Waveforms
      1. 6.2.1 Switching
      2. 6.2.2 Load Transient Response
      3. 6.2.3 Line Transient Response
      4. 6.2.4 Start-Up and Shutdown With EN
      5. 6.2.5 Start-Up and Shutdown with VIN
    3. 6.3 Bode Plot
    4. 6.4 CISPR 25 EMI Performance
    5. 6.5 Thermal Performance
  8. 7EVM Documentation
    1. 7.1 Schematic
    2. 7.2 List of Materials
    3. 7.3 PCB Layout
    4. 7.4 Component Drawings
  9. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
        1. 8.2.1.1 PCB Layout Resources
        2. 8.2.1.2 Thermal Design Resources

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated