SNVU890 January 2024
This section describes the EVM hardware and outlines the procedure to set up for evaluation. Figure 4-1 and Figure 4-2 show the top and bottom views of the LMG3100EVM-089, respectively.
The EVM can be mounted with a heat sink (S05MZZ37, 20 mm x 35 mm x 10 mm) to improve the thermal performance. The two exposed thermal pads have a high-voltage potential difference between them, therefore an electrically isolated thermal interface material (TIM) is used. TIM of GR80A-0H-50GY (thermal conductivity of 8 W/mK and thickness of 0.5 mm) has been placed between the device and the heat sink. Please make sure the TIM is making contact with both the heat sink and LMG3100 devices when heat sink is installed.