SNVU907A
July 2024 – August 2024
LM5137-Q1
,
LM5137F-Q1
1
Description
Get Started
Features
Applications
6
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specifications
1.3.1
Application Circuit Diagrams
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.4
Test Procedure
2.1.4.1
Line and Load Regulation, Efficiency
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Efficiency
3.1.2
Operating Waveforms
3.1.2.1
Load Transient Response
3.1.2.2
Startup/Shutdown With VIN
3.1.2.3
Startup/Shutdown With ENABLE ON and OFF
3.1.2.4
Switching
3.1.3
Thermal Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.2.1
Component Drawings
4.2.2
Layout Guidelines
4.3
Bill of Materials
5
Additional Information
5.1
Trademarks
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.2
Documentation Support
6.2.1
Related Documentation
6.2.1.1
PCB Layout Resources
6.2.1.2
Thermal Design Resources
7
Revision History
6.2.1.2
Thermal Design Resources
Texas Instruments,
AN-2020 Thermal Design by Insight, Not Hindsight
application report
Texas Instruments,
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
application report
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
application report
Texas Instruments,
Thermal Design Made Simple with LM43603 and LM43602
application report
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
application report
Texas Instruments,
PowerPAD™ Made Easy
application report
Texas Instruments,
Using New Thermal Metrics
application report