SNVU928 November   2024 LMR66430-EP

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 EVM Specifications
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Setup
      1. 2.1.1 Test Points
      2. 2.1.2 Jumpers
    2. 2.2 Operation: Quick Start
  8. 3Implementation Results
    1. 3.1 LMR66430NEP-EVM Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks

4.2 PCB Layout

LMR66430NEP-EVM Top View of EVM Figure 4-3 Top View of EVM
LMR66430NEP-EVM EVM Top Copper Layer Figure 4-4 EVM Top Copper Layer
LMR66430NEP-EVM Mid-Layer One Figure 4-5 Mid-Layer One
LMR66430NEP-EVM Mid-Layer Two Figure 4-6 Mid-Layer Two
LMR66430NEP-EVM EVM Bottom Copper Layer Figure 4-7 EVM Bottom Copper Layer
LMR66430NEP-EVM Bottom View of EVM Figure 4-8 Bottom View of EVM