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  • RM46Lx40 16- and 32-Bit RISC Flash Microcontroller

    • SPNS183C September   2012  – June 2015 RM46L440 , RM46L840

      PRODUCTION DATA.  

  • CONTENTS
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  • RM46Lx40 16- and 32-Bit RISC Flash Microcontroller
  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 PGE QFP Package Pinout (144-Pin)
    2. 4.2 ZWT BGA Package Ball-Map (337 Ball Grid Array)
    3. 4.3 Terminal Functions
      1. 4.3.1 PGE Package
        1. 4.3.1.1  Multibuffered Analog-to-Digital Converters (MibADC)
        2. 4.3.1.2  Enhanced High-End Timer Modules (N2HET)
        3. 4.3.1.3  Enhanced Capture Modules (eCAP)
        4. 4.3.1.4  Enhanced Quadrature Encoder Pulse Modules (eQEP)
        5. 4.3.1.5  Enhanced Pulse-Width Modulator Modules (ePWM)
        6. 4.3.1.6  General-Purpose Input / Output (GPIO)
        7. 4.3.1.7  Controller Area Network Controllers (DCAN)
        8. 4.3.1.8  Local Interconnect Network Interface Module (LIN)
        9. 4.3.1.9  Standard Serial Communication Interface (SCI)
        10. 4.3.1.10 Inter-Integrated Circuit Interface Module (I2C)
        11. 4.3.1.11 Standard Serial Peripheral Interface (SPI)
        12. 4.3.1.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        13. 4.3.1.13 Ethernet Controller
        14. 4.3.1.14 System Module Interface
        15. 4.3.1.15 Clock Inputs and Outputs
        16. 4.3.1.16 Test and Debug Modules Interface
        17. 4.3.1.17 Flash Supply and Test Pads
        18. 4.3.1.18 Supply for Core Logic: 1.2V nominal
        19. 4.3.1.19 Supply for I/O Cells: 3.3V nominal
        20. 4.3.1.20 Ground Reference for All Supplies Except VCCAD
      2. 4.3.2 ZWT Package
        1. 4.3.2.1  Multibuffered Analog-to-Digital Converters (MibADC)
        2. 4.3.2.2  Enhanced High-End Timer Modules (N2HET)
        3. 4.3.2.3  Enhanced Capture Modules (eCAP)
        4. 4.3.2.4  Enhanced Quadrature Encoder Pulse Modules (eQEP)
        5. 4.3.2.5  Enhanced Pulse-Width Modulator Modules (ePWM)
        6. 4.3.2.6  General-Purpose Input / Output (GPIO)
        7. 4.3.2.7  Controller Area Network Controllers (DCAN)
        8. 4.3.2.8  Local Interconnect Network Interface Module (LIN)
        9. 4.3.2.9  Standard Serial Communication Interface (SCI)
        10. 4.3.2.10 Inter-Integrated Circuit Interface Module (I2C)
        11. 4.3.2.11 Standard Serial Peripheral Interface (SPI)
        12. 4.3.2.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        13. 4.3.2.13 Ethernet Controller
        14. 4.3.2.14 External Memory Interface (EMIF)
        15. 4.3.2.15 System Module Interface
        16. 4.3.2.16 Clock Inputs and Outputs
        17. 4.3.2.17 Test and Debug Modules Interface
        18. 4.3.2.18 Flash Supply and Test Pads
        19. 4.3.2.19 Reserved
        20. 4.3.2.20 No Connects
        21. 4.3.2.21 Supply for Core Logic: 1.2V nominal
        22. 4.3.2.22 Supply for I/O Cells: 3.3V nominal
        23. 4.3.2.23 Ground Reference for All Supplies Except VCCAD
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings Over Operating Free-Air Temperature Range
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Device Recommended Operating Conditions
    5. 5.5  Switching Characteristics Over Recommended Operating Conditions for Clock Domains
    6. 5.6  Wait States Required
    7. 5.7  Power Consumption Over Recommended Operating Conditions
    8. 5.8  Input/Output Electrical Characteristics Over Recommended Operating Conditions
    9. 5.9  Thermal Resistance Characteristics
    10. 5.10 Output Buffer Drive Strengths
    11. 5.11 Input Timings
    12. 5.12 Output Timings
    13. 5.13 Low-EMI Output Buffers
  6. 6System Information and Electrical Specifications
    1. 6.1  Device Power Domains
    2. 6.2  Voltage Monitor Characteristics
      1. 6.2.1 Important Considerations
      2. 6.2.2 Voltage Monitor Operation
      3. 6.2.3 Supply Filtering
    3. 6.3  Power Sequencing and Power On Reset
      1. 6.3.1 Power-Up Sequence
      2. 6.3.2 Power-Down Sequence
      3. 6.3.3 Power-On Reset: nPORRST
        1. 6.3.3.1 nPORRST Electrical and Timing Requirements
    4. 6.4  Warm Reset (nRST)
      1. 6.4.1 Causes of Warm Reset
      2. 6.4.2 nRST Timing Requirements
    5. 6.5  ARM Cortex-R4F CPU Information
      1. 6.5.1 Summary of ARM Cortex-R4F CPU Features
      2. 6.5.2 ARM Cortex-R4F CPU Features Enabled by Software
      3. 6.5.3 Dual Core Implementation
      4. 6.5.4 Duplicate clock tree after GCLK
      5. 6.5.5 ARM Cortex-R4F CPU Compare Module (CCM-R4) for Safety
      6. 6.5.6 CPU Self-Test
        1. 6.5.6.1 Application Sequence for CPU Self-Test
        2. 6.5.6.2 CPU Self-Test Clock Configuration
        3. 6.5.6.3 CPU Self-Test Coverage
    6. 6.6  Clocks
      1. 6.6.1 Clock Sources
        1. 6.6.1.1 Main Oscillator
          1. 6.6.1.1.1 Timing Requirements for Main Oscillator
        2. 6.6.1.2 Low Power Oscillator
          1. 6.6.1.2.1 Features
        3. 6.6.1.3 Phase Locked Loop (PLL) Clock Modules
          1. 6.6.1.3.1 Block Diagram
          2. 6.6.1.3.2 PLL Timing Specifications
        4. 6.6.1.4 External Clock Inputs
      2. 6.6.2 Clock Domains
        1. 6.6.2.1 Clock Domain Descriptions
        2. 6.6.2.2 Mapping of Clock Domains to Device Modules
        3. 6.6.2.3 Special Clock Source Selection Scheme for VCLKA4_DIVR_EMAC
      3. 6.6.3 Clock Test Mode
    7. 6.7  Clock Monitoring
      1. 6.7.1 Clock Monitor Timings
      2. 6.7.2 External Clock (ECLK) Output Functionality
      3. 6.7.3 Dual Clock Comparators
        1. 6.7.3.1 Features
        2. 6.7.3.2 Mapping of DCC Clock Source Inputs
    8. 6.8  Glitch Filters
    9. 6.9  Device Memory Map
      1. 6.9.1 Memory Map Diagram
      2. 6.9.2 Memory Map Table
      3. 6.9.3 Special Consideration for CPU Access Errors Resulting in Imprecise Aborts
      4. 6.9.4 Master/Slave Access Privileges
      5. 6.9.5 Special Notes on Accesses to Certain Slaves
      6. 6.9.6 Parameter Overlay Module (POM) Considerations
    10. 6.10 Flash Memory
      1. 6.10.1 Flash Memory Configuration
      2. 6.10.2 Main Features of Flash Module
      3. 6.10.3 ECC Protection for Flash Accesses
      4. 6.10.4 Flash Access Speeds
      5. 6.10.5 Program Flash
      6. 6.10.6 Data Flash
    11. 6.11 Tightly Coupled RAM Interface Module
      1. 6.11.1 Features
      2. 6.11.2 TCRAM ECC Support
    12. 6.12 Parity Protection for Accesses to Peripheral RAMs
    13. 6.13 On-Chip SRAM Initialization and Testing
      1. 6.13.1 On-Chip SRAM Self-Test Using PBIST
        1. 6.13.1.1 Features
        2. 6.13.1.2 PBIST RAM Groups
      2. 6.13.2 On-Chip SRAM Auto Initialization
    14. 6.14 External Memory Interface (EMIF)
      1. 6.14.1 Features
      2. 6.14.2 Electrical and Timing Specifications
        1. 6.14.2.1 Asynchronous RAM
        2. 6.14.2.2 Synchronous Timing
    15. 6.15 Vectored Interrupt Manager
      1. 6.15.1 VIM Features
      2. 6.15.2 Interrupt Request Assignments
    16. 6.16 DMA Controller
      1. 6.16.1 DMA Features
      2. 6.16.2 Default DMA Request Map
    17. 6.17 Real Time Interrupt Module
      1. 6.17.1 Features
      2. 6.17.2 Block Diagrams
      3. 6.17.3 Clock Source Options
      4. 6.17.4 Network Time Synchronization Inputs
    18. 6.18 Error Signaling Module
      1. 6.18.1 Features
      2. 6.18.2 ESM Channel Assignments
    19. 6.19 Reset / Abort / Error Sources
    20. 6.20 Digital Windowed Watchdog
    21. 6.21 Debug Subsystem
      1. 6.21.1 Block Diagram
      2. 6.21.2 Debug Components Memory Map
      3. 6.21.3 JTAG Identification Code
      4. 6.21.4 Debug ROM
      5. 6.21.5 JTAG Scan Interface Timings
      6. 6.21.6 Advanced JTAG Security Module
      7. 6.21.7 Boundary Scan Chain
  7. 7Peripheral Information and Electrical Specifications
    1. 7.1  Enhanced Translator PWM Modules (ePWM)
      1. 7.1.1 ePWM Clocking and Reset
      2. 7.1.2 Synchronization of ePWMx Time Base Counters
      3. 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
      4. 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
      5. 7.1.5 ePWM Synchronization with External Devices
      6. 7.1.6 ePWM Trip Zones
        1. 7.1.6.1 Trip Zones TZ1n, TZ2n, TZ3n
        2. 7.1.6.2 Trip Zone TZ4n
        3. 7.1.6.3 Trip Zone TZ5n
        4. 7.1.6.4 Trip Zone TZ6n
      7. 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
      8. 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Timings
    2. 7.2  Enhanced Capture Modules (eCAP)
      1. 7.2.1 Clock Enable Control for eCAPx Modules
      2. 7.2.2 PWM Output Capability of eCAPx
      3. 7.2.3 Input Connection to eCAPx Modules
      4. 7.2.4 Enhanced Capture Module (eCAP) Timings
    3. 7.3  Enhanced Quadrature Encoder (eQEP)
      1. 7.3.1 Clock Enable Control for eQEPx Modules
      2. 7.3.2 Using eQEPx Phase Error to Trip ePWMx Outputs
      3. 7.3.3 Input Connections to eQEPx Modules
      4. 7.3.4 Enhanced Quadrature Encoder Pulse (eQEPx) Timing
    4. 7.4  Multibuffered 12bit Analog-to-Digital Converter
      1. 7.4.1 Features
      2. 7.4.2 Event Trigger Options
        1. 7.4.2.1 MIBADC1 Event Trigger Hookup
        2. 7.4.2.2 MIBADC2 Event Trigger Hookup
        3. 7.4.2.3 Controlling ADC1 and ADC2 Event Trigger Options Using SOC Output from ePWM Modules
      3. 7.4.3 ADC Electrical and Timing Specifications
      4. 7.4.4 Performance (Accuracy) Specifications
        1. 7.4.4.1 MibADC Nonlinearity Errors
        2. 7.4.4.2 MibADC Total Error
    5. 7.5  General-Purpose Input/Output
      1. 7.5.1 Features
    6. 7.6  Enhanced High-End Timer (N2HET)
      1. 7.6.1 Features
      2. 7.6.2 N2HET RAM Organization
      3. 7.6.3 Input Timing Specifications
      4. 7.6.4 N2HET1-N2HET2 Synchronization
      5. 7.6.5 N2HET Checking
        1. 7.6.5.1 Internal Monitoring
        2. 7.6.5.2 Output Monitoring using Dual Clock Comparator (DCC)
      6. 7.6.6 Disabling N2HET Outputs
      7. 7.6.7 High-End Timer Transfer Unit (HTU)
        1. 7.6.7.1 Features
        2. 7.6.7.2 Trigger Connections
    7. 7.7  Controller Area Network (DCAN)
      1. 7.7.1 Features
      2. 7.7.2 Electrical and Timing Specifications
    8. 7.8  Local Interconnect Network Interface (LIN)
      1. 7.8.1 LIN Features
    9. 7.9  Serial Communication Interface (SCI)
      1. 7.9.1 Features
    10. 7.10 Inter-Integrated Circuit (I2C)
      1. 7.10.1 Features
      2. 7.10.2 I2C I/O Timing Specifications
    11. 7.11 Multibuffered / Standard Serial Peripheral Interface
      1. 7.11.1 Features
      2. 7.11.2 MibSPI Transmit and Receive RAM Organization
      3. 7.11.3 MibSPI Transmit Trigger Events
        1. 7.11.3.1 MIBSPI1 Event Trigger Hookup
        2. 7.11.3.2 MIBSPI3 Event Trigger Hookup
        3. 7.11.3.3 MIBSPI5 Event Trigger Hookup
      4. 7.11.4 MibSPI/SPI Master Mode I/O Timing Specifications
      5. 7.11.5 SPI Slave Mode I/O Timings
    12. 7.12 Ethernet Media Access Controller
      1. 7.12.1 Ethernet MII Electrical and Timing Specifications
      2. 7.12.2 Ethernet RMII Electrical and Timing Specifications
      3. 7.12.3 Management Data Input/Output (MDIO)
  8. 8Device and Documentation Support
    1. 8.1 Device and Development-Support Tool Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation from Texas Instruments
      2. 8.2.2 Related Links
      3. 8.2.3 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
    6. 8.6 Device Identification
      1. 8.6.1 Device Identification Code Register
      2. 8.6.2 Die Identification Registers
    7. 8.7 Module Certifications
      1. 8.7.1 DCAN Certification
      2. 8.7.2 LIN Certification
        1. 8.7.2.1 LIN Master Mode
        2. 8.7.2.2 LIN Slave Mode - Fixed Baud Rate
        3. 8.7.2.3 LIN Slave Mode - Adaptive Baud Rate
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information
  10. IMPORTANT NOTICE
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DATA SHEET

RM46Lx40 16- and 32-Bit RISC Flash Microcontroller

1 Device Overview

1.1 Features

  • High-Performance Microcontroller for Safety-Critical Applications
    • Dual CPUs Running in Lockstep
    • ECC on Flash and RAM Interfaces
    • Built-In Self-Test (BIST) for CPU and On-chip RAMs
    • Error Signaling Module With Error Pin
    • Voltage and Clock Monitoring
  • ARM®Cortex®-R4F 32-Bit RISC CPU
    • 1.66 DMIPS/MHz With 8-Stage Pipeline
    • FPU With Single- and Double-Precision
    • 12-Region Memory Protection Unit (MPU)
    • Open Architecture With Third-Party Support
  • Operating Conditions
    • Up to 200-MHz System Clock
    • Core Supply Voltage (VCC): 1.14 to 1.32 V
    • I/O Supply Voltage (VCCIO): 3.0 to 3.6 V
  • Integrated Memory
    • 1.25MB of Program Flash With ECC (RM46L840)
    • 1MB of Program Flash With ECC (RM46L440)
    • 192KB of RAM With ECC (RM46L840)
    • 128KB of RAM With ECC (RM46L440)
    • 64KB of Flash for Emulated EEPROM With ECC
  • 16-Bit External Memory Interface (EMIF)
  • Common Platform Architecture
    • Consistent Memory Map Across Family
    • Real-Time Interrupt (RTI) Timer (OS Timer)
    • 128-Channel Vectored Interrupt Module (VIM)
    • 2-Channel Cyclic Redundancy Checker (CRC)
  • Direct Memory Access (DMA) Controller
    • 16 Channels and 32 Peripheral Requests
    • Parity Protection for Control Packet RAM
    • DMA Accesses Protected by Dedicated MPU
  • Frequency-Modulated Phase-Locked Loop (FMPLL) With Built-In Slip Detector
  • Separate Nonmodulating PLL
  • IEEE 1149.1 JTAG, Boundary Scan and ARM CoreSight™ Components
  • Advanced JTAG Security Module (AJSM)
  • Calibration Capabilities
    • Parameter Overlay Module (POM)
  • 16 General-Purpose Input/Output (GPIO) Pins Capable of Generating Interrupts
  • Enhanced Timing Peripherals for Motor Control
    • 7 Enhanced Pulse Width Modulator (ePWM) Modules
    • 6 Enhanced Capture (eCAP) Modules
    • 2 Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • Two Next Generation High-End Timer (N2HET) Modules
    • N2HET1: 32 Programmable Channels
    • N2HET2: 18 Programmable Channels
    • 160-Word Instruction RAM Each With Parity Protection
    • Each N2HET Includes Hardware Angle Generator
    • Dedicated High-End Timer Transfer Unit (HTU) for Each N2HET
  • Two 12-Bit Multibuffered Analog-to-Digital Converter (MibADC)Modules
    • ADC1: 24 Channels
    • ADC2: 16 Channels Shared With ADC1
    • 64 Result Buffers Each With Parity Protection
  • Multiple Communication Interfaces
    • 10/100 Mbps Ethernet MAC (EMAC)
      • IEEE 802.3 Compliant (3.3-V I/O Only)
      • Supports MII, RMII, and MDIO
    • Three CAN Controllers (DCANs)
      • 64 Mailboxes Each With Parity Protection
      • Compliant to CAN Protocol Version 2.0A and 2.0B
    • Inter-Integrated Circuit (I2C)
    • Three Multibuffered Serial Peripheral Interface (MibSPI) Modules
      • 128 Words Each With Parity Protection
      • 8 Transfer Groups
    • Up to Two Standard Serial Peripheral Interface (SPI) Modules
    • Two UART (SCI) Interfaces, One With Local Interconnect Network (LIN 2.1) Interface Support
  • Packages
    • 144-Pin Quad Flatpack (PGE) [Green]
    • 337-Ball Grid Array (ZWT) [Green]

1.2 Applications

  • Industrial Safety Applications
    • Industrial Automation
    • Safe Programmable Logic Controllers (PLCs)
    • Power Generation and Distribution
    • Turbines and Windmills
    • Elevators and Escalators
  • Medical Applications
    • Ventilators
    • Defibrillators
    • Infusion and Insulin Pumps
    • Radiation Therapy
    • Robotic Surgery

1.3 Description

The RM46Lx40 device is a high-performance microcontroller family for safety systems. The safety architecture includes dual CPUs in lockstep, CPU and memory BIST logic, ECC on both the flash and the data SRAM, parity on peripheral memories, and loopback capability on peripheral I/Os.

The RM46Lx40 device integrates the ARM Cortex-R4F floating-point CPU which offers an efficient 1.66 DMIPS/MHz, and can run up to 200 MHz providing up to 332 DMIPS. The device supports the little-endian [LE] format.

The RM46L840 device has 1.25MB of integrated flash and 192KB of data RAM with single-bit error correction and double-bit error detection. The RM46L440 device has 1MB of integrated flash and 128KB of data RAM with single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory, implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (same level as I/O supply) for all read, program, and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 200 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word, and double-word modes throughout the supported frequency range.

The RM46Lx40 device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors with up to 44 I/O terminals, seven Enhanced Pulse Width Modulator (ePWM) modules with up to 14 outputs, six Enhanced Capture (eCAP) modules, two Enhanced Quadrature Encoder Pulse (eQEP) modules, and two 12-bit Analog-to-Digital Converters (ADCs) supporting up to 24 inputs.

The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or general-purpose I/O (GIO). The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.

The ePWM module can generate complex pulse width waveforms with minimal CPU overhead or intervention. The ePWM is easy to use and it supports both high-side and low-side PWM and deadband generation. With integrated trip zone protection and synchronization with the on-chip MibADC, the ePWM module is ideal for digital motor control applications.

The eCAP module is essential in systems where the accurately timed capture of external events is important. The eCAP can also be used to monitor the ePWM outputs or for simple PWM generation when the eCAP is not needed for capture applications.

The eQEP module is used for direct interface with a linear or rotary incremental encoder to get position, direction, and speed information from a rotating machine as used in high-performance motion and position-control systems.

The device has two12-bit-resolution MibADCs with 24 total inputs and 64 words of parity-protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Sixteen inputs are shared between the two MibADCs. Each MibADC supports three separate groupings of channels. Each group can be converted once when triggered or configured for continuous conversion mode. The MibADC has a 10-bit mode for use when compatibility with older devices or faster conversion time is desired. MibADC1 also supports the use of external analog multiplexers.

The device has multiple communication interfaces: three MibSPIs, two SPIs, one LIN, one SCI, three DCANs, one I2C, and one Ethernet. The SPI provides a convenient method of serial high-speed communications between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format. The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for systems operating in noisy and harsh environments (for example, automotive and industrial fields) that require reliable serial communication or multiplexed wiring. The Ethernet module supports MII, RMII, and MDIO interfaces.

The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device through the I2C serial bus. The I2C supports speeds of 100 and 400 Kbps.

A Frequency-Modulated Phase-Locked Loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. The Global Clock Module (GCM) manages the mapping between the available clock sources and the device clock domains.

The device also has an External Clock Prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK terminal. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.

The Direct Memory Access (DMA) controller has 16 channels, 32 peripheral requests, and parity protection on its memory. An MPU is built into the DMA to protect memory against erroneous transfers.

The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt or external error pin (ball) is triggered when a fault is detected. The nERROR terminal can be monitored externally as an indicator of a fault condition in the microcontroller.

The External Memory Interface (EMIF) provides a memory extension to asynchronous and synchronous memories or other slave devices.

A Parameter Overlay Module (POM) enhances the calibration capabilities of application code. The POM can reroute flash accesses to internal memory or to the EMIF, thus avoiding the reprogramming steps necessary for parameter updates in flash.

With integrated safety features and a wide choice of communication and control peripherals, the RM46Lx40 device is an ideal solution for high-performance real-time control applications with safety-critical requirements.

Table 1-1 Device Information(1)

PART NUMBER PACKAGE BODY SIZE
RM46Lx40ZWT NFBGA (337) 16.0 mm × 16.0 mm
RM46Lx40PGE LQFP (144) 20.0 mm × 20.0 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.

1.4 Functional Block Diagram

RM46L440 RM46L840 fbd_f4_spns185.gifFigure 1-1 Functional Block Diagram

2 Revision History

This data manual revision history highlights the technical changes made to the SPNS183B device-specific data manual to make it an SPNS183C revision.

Scope: Applicable updates to the Hercules™ RM MCU device family, specifically relating to the RM46Lx40 devices, which are now in the production data (PD) stage of development have been incorporated.

Changes from March 14, 2015 to June 30, 2015 (from B Revision (March 2015) to C Revision)

  • Section 1.3 (Description): Corrected DMA description, 32 peripheral requests, not 32 control packetsGo
  • Table 4-18 (PGE Test and Debug Modules Interface): Specified size of pulldown on TDO during resetGo
  • Table 4-41 (ZWT Test and Debug Modules Interface): Specified size of pulldown on TDO during resetGo
  • Section 6.5.1 (Summary of ARM Cortex-R4F CPU Features): Added quantity of breakpoints and watchpoints Go
  • Table 6-21 (Device Memory Map): Corrected Bank 7 OTP sizeGo
  • Section 7.11.1 ([MibSPI] Features): Corrected size of SPI baud rate generator, 11 bit, not 8 bit Go
  • Figure 8-1 (RM46Lx40 Device Numbering Conventions): Updated/Changed figure to show the die revision letter.Go

3 Device Comparison

Table 3-1 lists the features of the RM46Lx40 devices.

Table 3-1 RM46Lx40 Device Comparison(2)(3)

FEATURES DEVICES
Generic Part Number RM48L952ZWT(1) RM46L852ZWT(1) RM46L840ZWT RM46L840PGE RM46L440ZWT RM46L440PGE RM44L520PGE RM42L432PZ
Package 337 BGA 337 BGA 337 BGA 144 QFP 337 BGA 144 QFP 144 QFP 100 QFP
CPU ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4F ARM Cortex-R4
Frequency (MHz) 220 220 200 200 200 200 200 100
Flash (KB) 3072 1280 1280 1280 1024 1024 768 384
RAM (KB) 256 192 192 192 128 128 128 32
Data Flash [EEPROM] (KB) 64 64 64 64 64 64 64 16
USB OHCI + Device 2+0 or 1+1 2+0 or 1+1 – – – – – –
EMAC 10/100 10/100 10/100 10/100 10/100 10/100 – –
CAN 3 3 3 3 3 3 3 2
MibADC
12-bit (Ch)		 2 (24ch) 2 (24ch) 2 (24ch) 2 x (24ch) 2 (24ch) 2 (24ch) 2 (24ch) 1 (16ch)
N2HET (Ch) 2 (44) 2 (44) 2 (44) 2 (40) 2 (44) 2 (40) 2 (40) 1 (19)
ePWM Channels – 14 14 14 14 14 14 –
eCAP Channels – 6 6 6 6 6 6 –
eQEP Channels – 2 2 2 2 2 2 1
MibSPI (CS) 3 (6 + 6 + 4) 3 (6 + 6 + 4) 3 (6 + 6 + 4) 3 (5 + 6 + 1) 3 (6 + 6 + 4) 3 (5 + 6 + 1) 3 (5 + 6 + 1) 1 (4)
SPI (CS) 2 (2 + 1) 2 (2 + 1) 2 (2 + 1) 1 (1) 2 (2 + 1) 1 (1) 1 (1) 2 (4 + 4)
SCI (LIN) 2 (1 with LIN) 2 (1 with LIN) 2 (1 with LIN) 2 (1 with LIN) 2 (1 with LIN) 2 (1 with LIN) 2 (1 with LIN) 1(with LIN)
I2C 1 1 1 1 1 1 1 –
GPIO (INT)(4) 144 (with 16 interrupt capable) 101 (with 16 interrupt capable) 101 (with 16 interrupt capable) 64 (with 10 interrupt capable) 101 (with 16 interrupt capable) 64 (with 10 interrupt capable) 64 (with 10 interrupt capable) 45 (with 8 interrupt capable)
EMIF 16-bit data 16-bit data 16-bit data – 16-bit data – – –
ETM [Trace] (Data) (32) – – – – – – –
RTP/DMM (Data) (16/16) – – – – – – –
Operating
Temperature		 -40ºC to 105ºC -40ºC to 105ºC -40ºC to 105ºC -40ºC to 105ºC -40ºC to 105ºC -40ºC to 105ºC -40ºC to 105ºC -40ºC to 105ºC
Core Supply (V) 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V 1.14 V – 1.32 V
I/O Supply (V) 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V 3.0 V – 3.6 V
(1) Superset device.
(2) For additional device variants, see www.ti.com/rm
(3) This table reflects the maximum configuration for each peripheral. Some functions are multiplexed and not all pins are available at the same time.
(4) Total number of pins that can be used as general purpose input or output when not used as part of a peripheral.

 
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