SPRAD67B December   2022  – September 2024 AM2431 , AM2432 , AM2434 , AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Before Getting Started With the Custom Board Design
    2. 1.2 Processor Selection
      1. 1.2.1 Availability of Tightly Coupled Memory (TCM)
    3. 1.3 Technical Documentation
      1. 1.3.1 Updated EVM or SK Schematics With Design, Review, and CAD Notes Added
      2. 1.3.2 FAQs to Support Custom Board Design
    4. 1.4 Design Documentation
  5. 2 Block Diagram
    1. 2.1 Constructing the Block Diagram
    2. 2.2 Configuring the Boot Mode
    3. 2.3 Confirming PinMux (PinMux Configuration)
  6. 3 Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power
      2. 3.1.2 Discrete Power
    2. 3.2 Power (Supply) Rails
      1. 3.2.1 Core Supply
      2. 3.2.2 Peripheral Power Supply
      3. 3.2.3 Dynamic Switching Dual-Voltage IO Supply LDO
      4. 3.2.4 Internal LDOs for IO Groups (Processor)
      5. 3.2.5 Dual-Voltage IOs (for Processor IO Groups)
      6. 3.2.6 VPP (eFuse ROM Programming) Supply
    3. 3.3 Determining Board Power Requirements
    4. 3.4 Power Supply Filters
    5. 3.5 Power Supply Decoupling and Bulk Capacitors
      1. 3.5.1 Note on PDN Target Impedance
    6. 3.6 Power Supply Sequencing
    7. 3.7 Supply Diagnostics
    8. 3.8 Power Supply Monitoring
  7. 4 Processor Clocking
    1. 4.1 Unused Clock Input
    2. 4.2 Processor External Clock Source
      1. 4.2.1 LVCMOS Digital Clock Source
      2. 4.2.2 Crystal Selection
    3. 4.3 Processor Clock Output
  8. 5 JTAG (Joint Test Action Group)
    1. 5.1 JTAG and Emulation
      1. 5.1.1 Configuration of JTAG and Emulation
        1. 5.1.1.1 AM64x
        2. 5.1.1.2 AM243x [ALV]
        3. 5.1.1.3 AM243x [ALX]
      2. 5.1.2 Implementation of JTAG and Emulation
      3. 5.1.3 Connection of JTAG Interface Signals
  9. 6 Configuration (Processor) and Initialization (Processor and Device)
    1. 6.1 Processor Reset
    2. 6.2 Latching of the Boot Mode Configuration
    3. 6.3 Resetting the Attached Devices
    4. 6.4 Watchdog Timer
  10. 7 Processor Peripherals
    1. 7.1 Selecting Peripherals Across Domains
    2. 7.2 Memory (DDRSS)
      1. 7.2.1 Processor DDR Subsystem and Device Register Configuration
      2. 7.2.2 Calibration Resistor Connection for DDRSS
      3. 7.2.3 Attached Memory Device ZQ and Reset_N Connection
    3. 7.3 Media and Data Storage Interfaces
    4. 7.4 Ethernet Interface
      1. 7.4.1 Common Platform Ethernet Switch 3-port Gigabit Ethernet (CPSW3G)
      2. 7.4.2 Programmable Real-Time Unit and Industrial Communication Subsystem - Gigabit (PRU_ICSSG)
    5. 7.5 Universal Serial Bus (USB) Subsystem
    6. 7.6 Peripheral Component Interconnect Express (PCIe) Subsystem
    7. 7.7 General Connectivity Peripherals
    8. 7.8 Analog-to-Digital Converter (ADC)
      1. 7.8.1 Change Summary of AM64x, AM243x SR2.0 ADC Errata
    9. 7.9 Connection of Processor Power Supply Pins, Unused Peripherals and IOs
      1. 7.9.1 External Interrupt (EXTINTn)
      2. 7.9.2 Reserved (RSVD) Pins
  11. 8 Interfacing of Processor IOs (LVCMOS or Open-Drain or Fail-Safe Type IO Buffers) and Simulations
    1. 8.1 AM64x
    2. 8.2 AM243x [ALV]
    3. 8.3 AM243x [ALX]
  12. 9 Processor Current Rating and Thermal Analysis
    1. 9.1 Power Estimation
    2. 9.2 Maximum Current Rating for Different Supply Rails
    3. 9.3 Power Modes
    4. 9.4 Thermal Design Guidelines
      1. 9.4.1 AM64x
      2. 9.4.2 AM243x [ALV]
      3. 9.4.3 AM243x [ALX]
      4. 9.4.4 VTM (Voltage Thermal Management Module)
  13. 10Schematics:- Design, Capture, Entry and Review
    1. 10.1 Selection of Components and Values
    2. 10.2 Schematic Design and Capture
    3. 10.3 Schematics Review
  14. 11Floor Planning, Layout, Routing Guidelines, Board Layers, and Simulation
    1. 11.1 Escape Routing for PCB Design
    2. 11.2 DDR Layout Guidelines
    3. 11.3 High-Speed Differential Signals Routing Guidance
    4. 11.4 Board Layer Count and Stack-up
      1. 11.4.1 Simulation Recommendations
    5. 11.5 Reference for Steps to be Followed for Running Memory Simulation
  15. 12Custom Board Assembly and Testing
    1. 12.1 Guidelines and Board Bring-up Tips
  16. 13Device Handling and Assembly
    1. 13.1 Soldering Recommendations
      1. 13.1.1 Additional References
  17. 14References
    1. 14.1 AM64x
    2. 14.2 AM243x
    3. 14.3 Common
  18. 15Terminology
  19. 16Revision History

7.7 General Connectivity Peripherals

The processor family supports multiple instances of Inter-Integrated Circuit (I2C), Universal Asynchronous Receive-Transmit (UART), 12-bit Analog-to-Digital Converters (ADC), Multichannel Serial Peripheral Interfaces (MCSPI), Fast Serial Interface Receiver (FSI_RX) cores, Fast Serial Interface Transmitter (FSI_TX) cores, Enhanced Pulse-Width Modulator (EPWM), Enhanced Capture (ECAP), Enhanced Quadrature Encoder Pulse (EQEP), Modular Controller Area Network (MCAN) modules with or without full CAN-FD support and GPIO. All LVCMOS IOs can be configured as GPIO.

Note:

For I2C interfaces with open-drain output type buffer (I2C0 and MCU_I2C0), an external pullup is recommended irrespective of peripheral usage and IO configuration. See the Pin Connectivity Requirements section of device-specific data sheet.

When the open-drain output type buffer I2C interfaces are pulled to 3.3V supply, the inputs have slew rate limit specified. An RC is recommended used to limit the slew rate. See the device-specific EVM or SK for implementation.

An external pullup is recommended for the I2C interfaces (I2C1..3 and MCU_I2C1) with LVCMOS IOs emulated open-drain outputs when the IOs are configured for I2C interface. For the available LVCMOS IOs with emulated open-drain output I2C instances, see the device-specific data sheet.

For more information, see the following FAQs:

[FAQ] AM6442, AM6441, AM6422, AM6421, AM6412, AM6411 Custom board hardware design – I2C interface

[FAQ] AM62A7-Q1: Internal pull configuration registers for MCU_I2C0 and WKUP_I2C0. This is a generic FAQ and can also be used for the AM64x or AM243x family of processors.

Additionally, PRU_ICSSG supports UART0, eCAP0, PWM, IEP0, and IEP1 peripheral modules.

The number of peripheral instances available depends on the processor selection. The required interfaces can be configured using the SysConfig-PinMux tool based on the application.

For more details, see the Peripherals chapter of the device-specific TRM.