SPRADB3A October   2023  – November 2024 AM2612 , AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4 , AM263P4-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Feature Differences Between AM26x Devices
  5. 2 Package Options
  6. 3 Feature Differences Between AM263 and AM263P
    1. 3.1 Feature Differences for System Consideration
      1. 3.1.1 New Features in AM263P
        1. 3.1.1.1 Resolver Peripheral
          1. 3.1.1.1.1 Migration From Software to Hardware Resolver
        2. 3.1.1.2 Trigonometric Math Unit
        3. 3.1.1.3 Remote L2 Cache
      2. 3.1.2 Memory Subsystem Differences
      3. 3.1.3 CONTROLSS Module Differences
        1. 3.1.3.1 ADC Feature Differences and Additions
        2. 3.1.3.2 ADC Safety Tile Additions
        3. 3.1.3.3 ADC_R Module Addition
      4. 3.1.4 QSPI/OSPI Module Differences
      5. 3.1.5 Hardware Security Module Differences
      6. 3.1.6 Hardware Differences
        1. 3.1.6.1 Sourcing VPP With ANALDO
      7. 3.1.7 Feature Omissions in AM263P
  7. 4 Software Changes Between AM263 and AM263P SDK
  8. 5 Feature Differences Between AM263 and AM261 Devices
    1. 5.1 Feature Differences for System Consideration
      1. 5.1.1 New Features in AM261
        1. 5.1.1.1 Universal Serial Bus (USB)
        2. 5.1.1.2 Trigonometric Math Unit
        3. 5.1.1.3 Remote L2 Cache
      2. 5.1.2 Memory Subsystem Differences
      3. 5.1.3 CONTROLSS Module Differences
        1. 5.1.3.1 ADC Feature Differences and Additions
        2. 5.1.3.2 ADC Safety Tile Additions
      4. 5.1.4 CPSW Feature Additions
      5. 5.1.5 Hardware Differences
        1. 5.1.5.1 Sourcing VPP With ANALDO
      6. 5.1.6 Feature Reductions in AM261
  9. 6 Software Changes Between AM263 and AM261 SDK
  10. 7 Feature Differences Between AM263P and AM261 Devices
    1. 7.1 Feature Differences for System Consideration
      1. 7.1.1 New Features in AM261
        1. 7.1.1.1 General-Purpose Memory Controller (GPMC)
        2. 7.1.1.2 Universal Serial Bus (USB)
      2. 7.1.2 Memory Subsystem Differences
      3. 7.1.3 CPSW Feature Additions
      4. 7.1.4 ADC Module Differences
      5. 7.1.5 Feature Omissions and Reductions in AM261
  11. 8 Software Changes Between AM263P and AM261 SDK
  12. 9 List of Errata Fixes in AM26x Devices
  13. 10Revision History

8 Software Changes Between AM263P and AM261 SDK

Component AM263P AM261
ADC IP Type 4 SDK includes driver changes, documentation, and SysConfig changes to support the following features:
  • 3MSPS
  • 7 Single Ended Channels
  • 4 External Channel Select Signals
CPSW CPSW Hardware feature enhanced.
SDK includes driver, documentation, and SysConfig to support the following features:
  • Support for cut-through switching
  • Support for 802.3br Interspersing Express Traffic (IET)
  • Enable 25MHz and 50MHz clock output signals for driving Ethernet PHYs
GPMC N/A New hardware feature.
SDK includes driver, documentation, and SysConfig to support the following features:
  • 16-bit parallel data bus and 22-bit address bus applications with GPMC
  • Memory expansion with External SRAM, PSRAM, NOR, and NAND memory options
HSM - PKE PKE v3 IP Hardware feature enhanced.
SDK includes driver, documentation, and SysConfig to support the following features:
  • PKE v4 IP with 4kB memory
ICSSM ICSSM at max clock 200MHz Hardware feature enhanced.
SDK includes driver, documentation, and SysConfig to support the following features:
  • Second instance of ICSSM
  • Max clock of 225MHz
  • Additional PRU GPIO pins: PR1_PRU0_GPIO17, PR1_PRU0_GPIO18, PR1_PRU0_GPIO19
  • Parallel and serial host interface capability using ICSSM
  • Support for half-duplex MII signals
  • Encoder Protocol support for: Endat, HDSL, Tamagawa, Nikkon, and Biss-C
OSPI OSPI Hardware feature enhanced.
SDK includes driver, documentation, and SysConfig to support the following features:
  • Second OSPI instance for optional SRAM, PSRAM, and flash device support
  • 1x OSPI instance with XIP at 166MHz
  • Serial NAND boot mode support
USB N/A New hardware feature.
SDK includes driver, documentation, and SysConfig to support the following features:
  • USB 2.0 support
  • TinyUSB Middleware support with:
    • Device Firmware Update (DFU), run time only
    • Booting via DFU - SBL DFU
    • Network with RNDIS, CDC-ACM, CDC-NCM
    • Mass Storage Class (MSC) with multiple Logical Units (LUNs)
XBAR XBAR Driver updates to reflect changes in integration between devices such as number of instances / signals.