SPRADB3A October   2023  – November 2024 AM2612 , AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4 , AM263P4-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Feature Differences Between AM26x Devices
  5. 2 Package Options
  6. 3 Feature Differences Between AM263 and AM263P
    1. 3.1 Feature Differences for System Consideration
      1. 3.1.1 New Features in AM263P
        1. 3.1.1.1 Resolver Peripheral
          1. 3.1.1.1.1 Migration From Software to Hardware Resolver
        2. 3.1.1.2 Trigonometric Math Unit
        3. 3.1.1.3 Remote L2 Cache
      2. 3.1.2 Memory Subsystem Differences
      3. 3.1.3 CONTROLSS Module Differences
        1. 3.1.3.1 ADC Feature Differences and Additions
        2. 3.1.3.2 ADC Safety Tile Additions
        3. 3.1.3.3 ADC_R Module Addition
      4. 3.1.4 QSPI/OSPI Module Differences
      5. 3.1.5 Hardware Security Module Differences
      6. 3.1.6 Hardware Differences
        1. 3.1.6.1 Sourcing VPP With ANALDO
      7. 3.1.7 Feature Omissions in AM263P
  7. 4 Software Changes Between AM263 and AM263P SDK
  8. 5 Feature Differences Between AM263 and AM261 Devices
    1. 5.1 Feature Differences for System Consideration
      1. 5.1.1 New Features in AM261
        1. 5.1.1.1 Universal Serial Bus (USB)
        2. 5.1.1.2 Trigonometric Math Unit
        3. 5.1.1.3 Remote L2 Cache
      2. 5.1.2 Memory Subsystem Differences
      3. 5.1.3 CONTROLSS Module Differences
        1. 5.1.3.1 ADC Feature Differences and Additions
        2. 5.1.3.2 ADC Safety Tile Additions
      4. 5.1.4 CPSW Feature Additions
      5. 5.1.5 Hardware Differences
        1. 5.1.5.1 Sourcing VPP With ANALDO
      6. 5.1.6 Feature Reductions in AM261
  9. 6 Software Changes Between AM263 and AM261 SDK
  10. 7 Feature Differences Between AM263P and AM261 Devices
    1. 7.1 Feature Differences for System Consideration
      1. 7.1.1 New Features in AM261
        1. 7.1.1.1 General-Purpose Memory Controller (GPMC)
        2. 7.1.1.2 Universal Serial Bus (USB)
      2. 7.1.2 Memory Subsystem Differences
      3. 7.1.3 CPSW Feature Additions
      4. 7.1.4 ADC Module Differences
      5. 7.1.5 Feature Omissions and Reductions in AM261
  11. 8 Software Changes Between AM263P and AM261 SDK
  12. 9 List of Errata Fixes in AM26x Devices
  13. 10Revision History

2 Package Options

This section provides an overview of all package options available for AM261, AM263, and AM263P microcontrollers. All offered device packages are NFBGA. The ZCZ package is the pin-to-pin compatible package across all three devices. Additionally, AM263P has a ZCZ-F package variant that includes an internally connected Silicon In Package (SIP) OSPI Flash device with 64Mb memory space.

Table 2-1 Package Options
Package Name Pin Count Dimensions Pitch AM263 AM263P AM261 Notes

ZCZ (AM263, AM261)

ZCZ-C (AM263P)

 324 15mmx15mm 0.8mm X X X Pin-to-pin Compatible package across devices
ZCZ-F 324 15mmx15mm 0.8mm X Flash-on-Package
ZCZ-S 324 15mmx15mm 0.8mm X
ZFG 204 13.25mmx13.25mm 0.65mm X
ZNC 293 10mmx10mm 0.5mm X
ZEJ 256 13mmx13mm 0.8mm X