SPRADB3A October   2023  – November 2024 AM2612 , AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P2 , AM263P4 , AM263P4-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Feature Differences Between AM26x Devices
  5. 2 Package Options
  6. 3 Feature Differences Between AM263 and AM263P
    1. 3.1 Feature Differences for System Consideration
      1. 3.1.1 New Features in AM263P
        1. 3.1.1.1 Resolver Peripheral
          1. 3.1.1.1.1 Migration From Software to Hardware Resolver
        2. 3.1.1.2 Trigonometric Math Unit
        3. 3.1.1.3 Remote L2 Cache
      2. 3.1.2 Memory Subsystem Differences
      3. 3.1.3 CONTROLSS Module Differences
        1. 3.1.3.1 ADC Feature Differences and Additions
        2. 3.1.3.2 ADC Safety Tile Additions
        3. 3.1.3.3 ADC_R Module Addition
      4. 3.1.4 QSPI/OSPI Module Differences
      5. 3.1.5 Hardware Security Module Differences
      6. 3.1.6 Hardware Differences
        1. 3.1.6.1 Sourcing VPP With ANALDO
      7. 3.1.7 Feature Omissions in AM263P
  7. 4 Software Changes Between AM263 and AM263P SDK
  8. 5 Feature Differences Between AM263 and AM261 Devices
    1. 5.1 Feature Differences for System Consideration
      1. 5.1.1 New Features in AM261
        1. 5.1.1.1 Universal Serial Bus (USB)
        2. 5.1.1.2 Trigonometric Math Unit
        3. 5.1.1.3 Remote L2 Cache
      2. 5.1.2 Memory Subsystem Differences
      3. 5.1.3 CONTROLSS Module Differences
        1. 5.1.3.1 ADC Feature Differences and Additions
        2. 5.1.3.2 ADC Safety Tile Additions
      4. 5.1.4 CPSW Feature Additions
      5. 5.1.5 Hardware Differences
        1. 5.1.5.1 Sourcing VPP With ANALDO
      6. 5.1.6 Feature Reductions in AM261
  9. 6 Software Changes Between AM263 and AM261 SDK
  10. 7 Feature Differences Between AM263P and AM261 Devices
    1. 7.1 Feature Differences for System Consideration
      1. 7.1.1 New Features in AM261
        1. 7.1.1.1 General-Purpose Memory Controller (GPMC)
        2. 7.1.1.2 Universal Serial Bus (USB)
      2. 7.1.2 Memory Subsystem Differences
      3. 7.1.3 CPSW Feature Additions
      4. 7.1.4 ADC Module Differences
      5. 7.1.5 Feature Omissions and Reductions in AM261
  11. 8 Software Changes Between AM263P and AM261 SDK
  12. 9 List of Errata Fixes in AM26x Devices
  13. 10Revision History

6 Software Changes Between AM263 and AM261 SDK

Component AM263 AM261
ADC IP Type 3
Driver v1		 New hardware feature now supports IP Type 4.
SDK includes driver, documentation, SysConfig, and examples in SDK for the new additions with Type 4.
Type 4 additions include the following:
  • DMA trigger (added feature)
  • SOC Trigger (added feature)
  • Trigger Repeater block (new feature set)
  • PPB Aggregator (new feature set)
  • External Channel Selection
  • Open Short Detection (new feature)
Additionally supports hardware changes for:
  • 3MSPS
  • 7 Single Ended Channels
  • 4 External Channel Select Signals
ADC Safety,
ADC Safety Aggr		 N/A New hardware feature.
SDK includes driver, documentation, SysConfig, and examples for the following features:
  • Comparison against any 2 selected results across most ADC modules
  • Usage of interrupts when one or more threshold reaches occur across all the ADC Safety Tiles
CPSW CPSW Hardware feature enhanced.
SDK includes driver, documentation, and SysConfig to support the following features:
  • Support for cut-through switching
  • Support for 802.3br Interspersing Express Traffic (IET)
  • Enable 25MHz and 50MHz clock output signals for driving Ethernet PHYs
SoC driver - ControlSS CTRL N/A New hardware feature.
SDK includes driver, documentation, SysConfig, and examples for the following features:
  • Dynamic clock gating
  • How to configure the EPWM to use WLINK
HSM - PKE PKE v3 IP Hardware feature enhanced.
SDK includes driver, documentation, unit test, and SysConfig to support the following features:
  • PKE v4 IP with 4kB memory
ICSSM ICSSM at max clock 200MHz Hardware feature enhanced.
SDK includes driver, documentation, and SysConfig to support the following features:
  • Second instance of ICSSM
  • Max clock of 225MHz
  • Additional PRU GPIO pins: PR1_PRU0_GPIO17, PR1_PRU0_GPIO18, PR1_PRU0_GPIO19
  • Parallel and serial host interface capability using ICSSM
  • Support for half-duplex MII signals
  • Encoder Protocol support for: Endat, HDSL, Tamagawa, Nikkon, and Biss-C
Trip and Sync XBAR N/A New hardware feature.
SDK includes driver, documentation, SysConfig, and examples for the following features:
  • New XBARs - EXTCHSEL, EQEP SOCAB XBAR, new groups to XBARs
  • XBAR clock gating
Opti-Flash
  • FLC
  • RL2
  • RAT
 N/A New hardware feature.
SDK includes driver, documentation, SysConfig, and examples for the following features:
  • RL2 example for how to configure the new feature
  • FLC example for early CAN response
OSPI QPSI New hardware feature.
SDK includes driver, documentation, SysConfig, and examples for the following features:
  • Flash Diagnostics Example
  • Flash DMA Example
  • Flash IO Example
  • Use of two chip select pins
  • Serial NAND boot mode support
  • Second OSPI instance can optionally support SRAM, PSRAM, and flash devices

QSPI is also supported with FLASH API which internally uses OSPI, however this requires software updates when transitioning from AM263 to AM263P.
SBL OSPI SBL QSPI SBL-OSPI is provided for AM261
XBAR XBAR Driver updates to reflect changes in integration between devices such as number of instances / signals.
eXecute In Place (XIP) support N/A New hardware feature.
Enabling XIP functionality does not require dedicated drivers.
With XIP functionality offered in AM261, it is possible to change the boot flow on a per application basis to leverage XIP.
Firmware Over the Air Update (FOTA) N/A

New hardware feature.

SDK includes driver, documentation, and SysConfig.
On The Fly Encryption and Authentication (OTFA) N/A New hardware feature.
SDK includes driver, documentation, and SysConfig.
USB N/A New hardware feature.
SDK includes driver, documentation, and SysConfig to support the following features:
  • USB 2.0 support
  • TinyUSB Middleware support with:
    • Device Firmware Update (DFU), run time only
    • Booting via DFU - SBL DFU
    • Network with RNDIS, CDC-ACM, CDC-NCM
    • Mass Storage Class (MSC) with multiple Logical Units (LUNs)