SPRADB7 September   2023 AM2431 , AM2432 , AM2434 , AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4 , AM263P4-Q1 , AM2732 , AM2732-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 How to Use This Application Note
    2. 1.2 Glossary
  5. 2Thermal Resistance Overview
    1. 2.1 Junction Vs. Ambient Temperature
    2. 2.2 Package Defined Thermal Resistance Characteristics
    3. 2.3 Board Defined Thermal Resistances
  6. 3Board Design Choices that Affect Thermal Performance
    1. 3.1 Thermal Vias
    2. 3.2 Board Size
    3. 3.3 Air Flow, Heat Sinking, and Enclosures
    4. 3.4 Copper Thickness
    5. 3.5 Relative Position of Heat Emitters
    6. 3.6 Layer Count
    7. 3.7 Breaks in Thermal Pathing
  7. 4Thermal Design Best Practices Review
  8. 5AM263x EVM Thermal Comparison with Data
    1. 5.1 Test Setup and Materials
    2. 5.2 Measurement Logging Software
    3. 5.3 AM263x EVM Comparison
    4. 5.4 Measurement Results
      1. 5.4.1 Lid Temperature Readings
      2. 5.4.2 Power Readings over Temperature
      3. 5.4.3 Calculated Thermal Resistance Values
      4. 5.4.4 Recorded Junction and Ambient Temperatures
      5. 5.4.5 Calculated Junction Temperature at Ambient Temperature Extremes
  9. 6Using the Thermal Model
  10. 7References

1 Introduction

Note: This document serves to explain some best practices for thermal dissipation when designing a board. For the most accurate thermal representation of a system, import the device thermal model as well as the board properties into a thermal simulation program. For more information on using the Thermal Model, see the Section 6.