SPRADB7 September 2023 AM2431 , AM2432 , AM2434 , AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4 , AM263P4-Q1 , AM2732 , AM2732-Q1
The two EVMs that were used to observe junction temperature in relation to ambient temperature are the AM263x Control Card and AM263x LaunchPad. These two systems have different qualities and design choices that affect the thermal performance of the AM263x SoC. Table 5-1 details the relevant differences in PCB design.
Measurement | TMDSCNCD263 | LP-AM263 |
---|---|---|
Number of thermal vias | 90 | 90 |
Drill hole diameter | 8 mil | 8 mil |
Plating thickness | 35 um | 20-30 um |
Conductively filled vias | Resin filled | Empty cavity |
Board dimensions | 105.76 x 82.81 mm + 6.09 mm length of HSEC | 195.58 x 58.42 mm |
Approx. Surface Area | 9,300 mm2 | 11,400 mm2 |
Distance from SoC to board edge | 13.39 mm | 22.89 mm |
Ground layer copper thickness | 1.26 mil | 1.26 mil |
Copper weight | 1 oz/sq ft | 1 oz/sq ft |
Total number of layers | 10 | 6 |
Number of ground layers | 4 | 2 |
Based on the comparison table, it can be theorized that the thermal performance of the AM263x Control Card will be better than the AM263x LaunchPad. Despite the Launchpad having a slightly larger surface area, the Control Card features four ground layers for improved heat dispersion. Designing the PCB with twice as many ground layers should have a very apparent impact on the relationship between junction temperature and ambient temperature.