SPRADI9 June   2024 AM623 , AM625

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Design-Based Approach
  6. 3Background
    1. 3.1 Process Delivery Kit (PDK)
    2. 3.2 SPICE Models for Circuit Behavior
    3. 3.3 Electronic Design Automation (EDA) Tools
    4. 3.4 Package Reliability
  7. 4Comparison of Design-Based Approach vs. HTOL Approach
  8. 5AM625/623 Lifetime Reliability Analysis Results
  9. 6Conclusion
  10. 7Revision History
  11.   A Appendix – The HTOL-Based Approach
  12.   B Appendix – The Mathematic Basis for EM Reliability Estimates

3 Background

TI Embedded Processing’s overall approach to lifetime (also known as intrinsic) reliability is to embed this into the design and manufacturing process, starting from component-level reliability (transistors, didoes, capacitors, resistors, etc.) through final System-on-Chip (SoC) product release. This process, called Correct by Construction, is illustrated at a high level in Figure 3-1.


AM625 AM623 Correct by Construction Reliability Approach – From Inception to Product Release

Figure 3-1 Correct by Construction Reliability Approach – From Inception to Product Release