SPRADI9 June   2024 AM623 , AM625

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Design-Based Approach
  6. 3Background
    1. 3.1 Process Delivery Kit (PDK)
    2. 3.2 SPICE Models for Circuit Behavior
    3. 3.3 Electronic Design Automation (EDA) Tools
    4. 3.4 Package Reliability
  7. 4Comparison of Design-Based Approach vs. HTOL Approach
  8. 5AM625/623 Lifetime Reliability Analysis Results
  9. 6Conclusion
  10. 7Revision History
  11.   A Appendix – The HTOL-Based Approach
  12.   B Appendix – The Mathematic Basis for EM Reliability Estimates

1 Introduction

This application note applies to the device families mentioned below. Product related documentation is available on the product pages on TI.com.

AM62x Processor Family

AM625

  • AM6254
  • AM6252
  • AM6251

AM623

  • AM6234
  • AM6232
  • AM6231
Note: Content referring to temperatures greater than 105°C junction temperature and up to 125°C, only applies to extended temperature devices as specified in data sheet Recommended Operating Conditions.

This document provides an overview of the intrinsic reliability capabilities and applied methodologies of the AM62x ARM based processors family. TI, along with IP (Intellectual Protocol), Computer-Aided Design (CAD) tool and foundry partners, has developed robust design targets and an advanced design (and design-verification) based approach to meet or exceed market expectations for application mission lifetime profiles. The term mission profile means a table of variable temperature tiers (at fixed voltage and frequency), with each temperature at some fixed duration, with each tier summing to a total lifetime. The lifetime at each tier (and the total) is normally expressed in Power-on Hours (POH). The table is to represent exposure to these various conditions throughout the lifetime of the product. Alternatively, reliability can be represented as a table or graph of POH (dependent variable) as a function of specific temperature and/or voltage or frequency (as the independent variable).

Table 1-1 Example of a Reference Mission Profile (Multi-Temperature Tier) in a TI Data Sheet (AM62Ax Sitara Processors Data Manual)
Power-on Hours (POH)(1)(2)(3)
Junction Temperature Range (TJ)Lifetime (POH)
Extended-40°C to 105°C100000
Automotive-40°C to 125°C20000 (4)
(1) This information is provided solely for your convience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products.
(2) Unless specified in the table above, all voltage domains and operating conditions are supported in the device at the noted temperatures.
(3) POH is a function of voltage, temperature, and time. Usage at higher voltages and temperatures result in a reduction in POH.
(4) Automotive profile is defined as 20000 power on hours with a junction temperature as follows: 5% at -40°C, 65% at 70°C, 20% at 110°C, and 10% at 125°C.
Table 1-2 Example Temerature vs. POH Table (AM243X Data Manual, TI Publication
Temperature Rating Temperature Range Junction (TJ) (1) Estimated Lifetime(2) POH (3)
A -40°C to 105°C 105°C 100000
I -40°C to 125°C 105°C 100000
110°C 64000
115°C 41000
120°C 26500
125°C 17500
(1) Unless specified, all voltage domains and operating conditions are supported in the device at the noted temperatures.
(2) This information is provided solely for your convience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products.
(3) POH is a function of voltage, temperature and time. Usage at higher voltages and temperatures results in a reduction in POH.