SPRUII1A November   2017  – January 2020

 

  1.   Fusion Application Board
    1.     Trademarks
    2. 1 Introduction
    3. 2 Overview
      1. 2.1 Fusion Application Board
      2. 2.2 Fusion Board Features
    4. 3 Hardware
      1. 3.1  Hardware Architecture
        1. 3.1.1 Fusion Application Board With Component Identification
      2. 3.2  TDAx EVM Compatibility
      3. 3.3  Fusion Power
      4. 3.4  DS90UB960 Modes
        1. 3.4.1 Power over Coax (PoC)
      5. 3.5  I2C Addressing
        1. 3.5.1 Multiple Device Addressing (Aliasing)
        2. 3.5.2 I2C Bus Switches and Connections
      6. 3.6  EVM Interface
      7. 3.7  Sensor Connection
      8. 3.8  MSP430™ Microcontroller
      9. 3.9  Configuration Options
        1. 3.9.1 Dipswitch (S3)
        2. 3.9.2 Bank 1 Power (J27)
        3. 3.9.3 Bank 2 Power (J22)
      10. 3.10 Status LEDs
      11. 3.11 External Interfaces
    5. 4 Image Sensor Module (Optional)
      1. 4.1 OV2775 Image Sensor
      2. 4.2 DS90UB953-Q1 Serializer
    6. 5 Getting Started
      1. 5.1 Powering Up the Fusion Application Board
  2.   Revision History

3.9.2 Bank 1 Power (J27)

Connector J27 provides power to the other eight connectors depending on if coax (J28, J30, J32, and J34) or HSD (J29, J31, J33, and J35) has been chosen. For the location and configuration of J27, see Figure 3. If no sensors will be used on the connectors, then do not populate a jumper on J27 (see Figure 8).

J27_config.gifFigure 8. J27 Bank 1 Jumper Configurations