SPRUII1A November   2017  – January 2020

 

  1.   Fusion Application Board
    1.     Trademarks
    2. 1 Introduction
    3. 2 Overview
      1. 2.1 Fusion Application Board
      2. 2.2 Fusion Board Features
    4. 3 Hardware
      1. 3.1  Hardware Architecture
        1. 3.1.1 Fusion Application Board With Component Identification
      2. 3.2  TDAx EVM Compatibility
      3. 3.3  Fusion Power
      4. 3.4  DS90UB960 Modes
        1. 3.4.1 Power over Coax (PoC)
      5. 3.5  I2C Addressing
        1. 3.5.1 Multiple Device Addressing (Aliasing)
        2. 3.5.2 I2C Bus Switches and Connections
      6. 3.6  EVM Interface
      7. 3.7  Sensor Connection
      8. 3.8  MSP430™ Microcontroller
      9. 3.9  Configuration Options
        1. 3.9.1 Dipswitch (S3)
        2. 3.9.2 Bank 1 Power (J27)
        3. 3.9.3 Bank 2 Power (J22)
      10. 3.10 Status LEDs
      11. 3.11 External Interfaces
    5. 4 Image Sensor Module (Optional)
      1. 4.1 OV2775 Image Sensor
      2. 4.2 DS90UB953-Q1 Serializer
    6. 5 Getting Started
      1. 5.1 Powering Up the Fusion Application Board
  2.   Revision History

2.2 Fusion Board Features

The fusion board features follow:

  • Power supply:
    • 12-V DC input from a power source or EVM
    • Optimized power management solution
    • Reverse voltage protection
    • eFuse protection, in case of failing sensors
    • Selectable 12 V or 5 V to camera/radar modules
  • Printed circuit board (PCB):
    • Dimensions (W × D): 170 mm × 170 mm
    • Expansion connector to the Texas Instruments compatible EMV
  • Memory: I2C configuration EEPROM
  • Coax/high-speed input:
    • Up to eight, high-speed, data inputs connected at once
    • Can support up to eight coax inputs, or four coax and four HSD inputs
    • Supports a variety of modules including multi-camera, RADAR, and LIDAR inputs
  • DS90UB960-Q1 quad deserializer hub:
    • Two DS90UB960-Q1 devices, each with a four-channel deserializer with up to eight connected sensors
    • Reduce cabling with dual CSI-2 ports
    • Can be paired with DS90UB953-Q1 serializers
    • Flexible GPIOs for sensor synchronization and diagnostics
  • MSP430F2272-Q1 device:
    • Hardware strapping allows the MSP430 device to be bypassed (not in circuit)
    • Can be used as a housekeeping and configuration microcontroller
    • Enables synchronization with the EVM upon power up
  • PoC:
    • Selectable 12 V or 5 V for camera and radar modules
    • Sensor data, I2C control, diagnostics, and power can all be transmitted up to 15 meters on a single, inexpensive, coax cable
    • Up to four 8 W and four 1.5 W PoC (sourced from external supply, J14)
  • External interfaces:
    • 40-pin, CSI-2, LVDS connector
    • 10-pin, Aardvark, I2C connector
    • MSP430 programming header
    • Header pins to the external microcontroller