SPRUII1A November   2017  – January 2020

 

  1.   Fusion Application Board
    1.     Trademarks
    2. 1 Introduction
    3. 2 Overview
      1. 2.1 Fusion Application Board
      2. 2.2 Fusion Board Features
    4. 3 Hardware
      1. 3.1  Hardware Architecture
        1. 3.1.1 Fusion Application Board With Component Identification
      2. 3.2  TDAx EVM Compatibility
      3. 3.3  Fusion Power
      4. 3.4  DS90UB960 Modes
        1. 3.4.1 Power over Coax (PoC)
      5. 3.5  I2C Addressing
        1. 3.5.1 Multiple Device Addressing (Aliasing)
        2. 3.5.2 I2C Bus Switches and Connections
      6. 3.6  EVM Interface
      7. 3.7  Sensor Connection
      8. 3.8  MSP430™ Microcontroller
      9. 3.9  Configuration Options
        1. 3.9.1 Dipswitch (S3)
        2. 3.9.2 Bank 1 Power (J27)
        3. 3.9.3 Bank 2 Power (J22)
      10. 3.10 Status LEDs
      11. 3.11 External Interfaces
    5. 4 Image Sensor Module (Optional)
      1. 4.1 OV2775 Image Sensor
      2. 4.2 DS90UB953-Q1 Serializer
    6. 5 Getting Started
      1. 5.1 Powering Up the Fusion Application Board
  2.   Revision History

1 Introduction

The Fusion application board allows up to eight, high-speed, data sources, such as megapixel imagers and RADAR and LIDAR sensors, to be combined into two digital MIPI CSI-2 output ports, which are then connected to a Texas Instruments compatible evaluation module (EVM), with stand-alone operation (see Figure 1). Each sensor source connects to one of the hubs through a single coax cable or twisted pair (HSD). Two DS90UB960 FPD-Link III hubs are on the board. Each DS90UB960 device outputs four, high-speed, data inputs on only one CSI-2 LVDS interface. This greatly simplifies the system by combining eight sensor inputs into two outputs. These outputs are available on an external connector that attaches to an EVM or a similar SoC/processor. Because the Fusion application board supports multiple video inputs and multiplexing options, it is a well suited solution for Advanced Driver Assistance Systems (ADAS) development activity.

The Fusion application board EVM consists of the following:

  • PCB application board:
    • Accepts eight, high-speed data inputs over FPD-Link III
    • Uses two DS90UB960-Q1 devices for CSI-2 output to directly connect to CSI-2 video ports
    • Provides a wide-range supply voltage for Power over Coax (PoC: 4 to 14 V)
  • FPD-Link III DS90UB960-Q1: Supports eight, high-speed, data inputs with only two outputs, for surround and stereoscopic view and ease of design
  • Interfaces with various TI EVMs, including TDA2Px, TDA2Ex, TDA3x, and TDA4
  • Stand-alone operation:
    • Board power can come directly from a car battery (3.8 V to 65 V) or power source
    • Onboard MSP430F2272-Q1 device for stand-alone operation
    • Provides up to four 8 W and four 1.5 W PoC to each of the FPD-Link III inputs

Use this board with the Texas Instruments compatible EVM to enable a complete system solution.

Fusion_application_board.gifFigure 1. Fusion Application Board