SPRUII1A November   2017  – January 2020

 

  1.   Fusion Application Board
    1.     Trademarks
    2. 1 Introduction
    3. 2 Overview
      1. 2.1 Fusion Application Board
      2. 2.2 Fusion Board Features
    4. 3 Hardware
      1. 3.1  Hardware Architecture
        1. 3.1.1 Fusion Application Board With Component Identification
      2. 3.2  TDAx EVM Compatibility
      3. 3.3  Fusion Power
      4. 3.4  DS90UB960 Modes
        1. 3.4.1 Power over Coax (PoC)
      5. 3.5  I2C Addressing
        1. 3.5.1 Multiple Device Addressing (Aliasing)
        2. 3.5.2 I2C Bus Switches and Connections
      6. 3.6  EVM Interface
      7. 3.7  Sensor Connection
      8. 3.8  MSP430™ Microcontroller
      9. 3.9  Configuration Options
        1. 3.9.1 Dipswitch (S3)
        2. 3.9.2 Bank 1 Power (J27)
        3. 3.9.3 Bank 2 Power (J22)
      10. 3.10 Status LEDs
      11. 3.11 External Interfaces
    5. 4 Image Sensor Module (Optional)
      1. 4.1 OV2775 Image Sensor
      2. 4.2 DS90UB953-Q1 Serializer
    6. 5 Getting Started
      1. 5.1 Powering Up the Fusion Application Board
  2.   Revision History

3.2 TDAx EVM Compatibility

The Fusion board is designed to match the size of various processor EVMs, such as the TDA2xEco or TDA2Px EVM. The TDA2Px processor is designed for automotive ADAS and self-driving car applications. The board size of the TDA3x EVM is larger than the EVMs previously mentioned, but the mounting holes are placed in the same position on all the boards, to maintain overall compatibility. Similarly, the Fusion board can interface with the TDA4 EVM, mounted of to the side of the EVM. The Fusion board can also connect to a J6Eco, J6Entry, or other EVMs with the same connector. An additional SAMTEC HQCD connector cable is needed to connect to the J6Eco or J6Entry. As a result, the connection between the board and the EVM must be in a fixed position too.