SPRUIL1D May 2019 – December 2024 DRA829J , DRA829J-Q1 , DRA829V , DRA829V-Q1 , TDA4VM , TDA4VM-Q1
All modules and subsystems in the device communicate with each other through the system interconnect for any memory map accesses. It is partitioned into the following sections:
These interconnects are used for data transfers and configuration. They are composed by switch fabrics enabling fast internal data movement. They also provide low-latency and concurrent data transfers between master and slave peripherals.
The CBASS0 is further partitioned in the following sub-interconnects:
Most of the device modules are connected to the CBASS0 interconnect that is located in VD_CORE. These modules, INFRA_CBASS0 and CBASS0 are part of the device MAIN domain. MCU_CBASS0 resides in VD_MCU and connects all modules from the MCU domain. WKUP_CBASS0 is located in VD_WKUP and is for modules in the WKUP domain. INFRA_CBASS0 contains almost all infrastructure and internal diagnostic components and also peripherals not power managed in the MAIN domain.
Figure 3-1 shows the device system interconnect. All modules and subsystems can be classified into two categories: masters and slaves. The masters are capable of initiating read and write transfers in the system. The slaves on the other hand depend on the masters to perform transfers to and from them. They cannot generate read/write requests but can respond to these requests generating interrupts or DMA requests.