SPRUIW8 November   2020

 

  1.   Trademarks
  2. 1Board Overview
    1. 1.1 Kit Contents
    2. 1.2 Features
    3. 1.3 Specifications
    4. 1.4 Using the F28002x LaunchPad
    5. 1.5 BoosterPacks
    6. 1.6 Hardware Revisions
      1. 1.6.1 Revision A
  3. 2Software Development
    1. 2.1 Software Tools and Packages
    2. 2.2 F28002x LaunchPad Demo Program
    3. 2.3 Programming and Running Other Software on the F28002x LaunchPad
  4. 3Hardware Description
    1. 3.1 Functional Description and Connections
      1. 3.1.1  Microcontroller
      2. 3.1.2  LEDs
      3. 3.1.3  Encoder Connectors
      4. 3.1.4  FSI
      5. 3.1.5  CAN
      6. 3.1.6  CLB
      7. 3.1.7  Boot Modes
      8. 3.1.8  BoosterPack Headers
        1. 3.1.8.1 BoosterPack Sites
      9. 3.1.9  Analog Voltage Reference Header
      10. 3.1.10 Other Headers and Jumpers
        1. 3.1.10.1 USB Isolation Block
        2. 3.1.10.2 BoosterPack Site 2 Power Isolation
        3. 3.1.10.3 Alternate Power
        4. 3.1.10.4 5 V Step-up Converter
    2. 3.2 Debug Interface
      1. 3.2.1 XDS110 Debug Probe
      2. 3.2.2 XDS110 Output
      3. 3.2.3 Virtual COM Port
    3. 3.3 Alternate Routing
      1. 3.3.1 Overview
      2. 3.3.2 UART Routing
      3. 3.3.3 EQEP Routing
      4. 3.3.4 CAN Routing
      5. 3.3.5 FSI Routing
      6. 3.3.6 X1/X2 Routing
      7. 3.3.7 PWM DAC
      8. 3.3.8 Other GPIOs
  5. 4Board Design
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 BOM
    4. 4.4 LAUNCHXL-F280025C Board Dimensions
  6. 5Frequently Asked Questions
  7. 6References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design

CAN Routing

The LaunchPad can be connected to a CAN bus through J14. GPIO32 and GPIO33 are routed to the on-board TI SN65HVD234 3.3 V CAN Transceiver, U15. By setting S4 to DOWN (on), GPIO32 and GPIO33 are routed to the transceiver. If S4 is set to UP (off), the GPIOs are routed to the BoosterPack connectors. Note that GPIO32 is also a boot mode select pin of the F28002x device and may be pulled up or down, see Section 3.1.7.