SPRZ506D October   2022  – December 2024 TMS320F2800132 , TMS320F2800133 , TMS320F2800135 , TMS320F2800137

 

  1.   1
  2.   TMS320F28003x Real-Time MCUs Silicon ErrataSilicon Revision 0
  3. 1Usage Notes and Advisories Matrices
    1. 1.1 Usage Notes Matrix
    2. 1.2 Advisories Matrix
  4. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development-Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  5. 3Silicon Revision C Usage Notes and Advisories
    1. 3.1 Silicon Revision C Usage Notes
      1. 3.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear
      2. 3.1.2 Caution While Using Nested Interrupts
      3. 3.1.3 Security: The primary layer of defense is securing the boundary of the chip, which begins with enabling JTAGLOCK and Zero-pin Boot to Flash feature
    2. 3.2 Silicon Revision C Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8. 3.2.1 Advisory
      9.      Advisory
      10. 3.2.2 Advisory
      11. 3.2.3 Advisory
      12.      Advisory
      13.      Advisory
      14.      Advisory
      15.      Advisory
      16. 3.2.4 Advisory
      17.      Advisory
      18. 3.2.5 Advisory
      19.      Advisory
  6. 4Silicon Revision B Usage Notes and Advisories
    1. 4.1 Silicon Revision B Usage Notes
    2. 4.2 Silicon Revision B Advisories
  7. 5Silicon Revision A Usage Notes and Advisories
    1. 5.1 Silicon Revision A Usage Notes
    2. 5.2 Silicon Revision A Advisories
  8. 6Silicon Revision 0 Usage Notes and Advisories
    1. 6.1 Silicon Revision 0 Usage Notes
    2. 6.2 Silicon Revision 0 Advisories
  9. 7Documentation Support
  10. 8Trademarks
  11. 9Revision History

2.1 Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, TMS320F2800137). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX and TMDX) through fully qualified production devices and tools (TMS and TMDS).

Device development evolutionary flow:

    TMX Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    TMS Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.