SSZTAG9 january   2017 CC2640 , CC2640R2F , CC2640R2F-Q1

 

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    2. 5.  Expansion of the SimpleLink™ CC2640 Family
    3. 4.     More Available Flash Memory
    4. 3.     Wafer-chip-scale (WCSP) Package
    5. 2.     Automotive Qualification - Samples Coming in February
    6. 1.     Bluetooth 5 Software Support

Casey O'Grady

Here are the top 5 things you need to know about TI’s latest Bluetooth® low energy device: SimpleLink™ CC2640R2F wireless microcontroller (MCU).

4.     More Available Flash Memory

As user applications continue to become more sophisticated, additional flash memory is crucial for next generation designs.  With CC2640R2F wireless MCU the Bluetooth 4.2 protocol stack is in ROM, freeing 80+KB of flash for user application code.

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3.     Wafer-chip-scale (WCSP) Package

Now available in WCSP package, the CC2640R2F solution is great for space constrained applications with a tiny 2.7 x 2.7 mm footprint.  This not only is the thinnest package option but also has four additional general-purpose input/output pins (GPIO) than the 4x4 mm QFN package.

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2.     Automotive Qualification - Samples Coming in February

The CC2640R2F wireless MCU will be AEC-Q100 qualified making it the most robust Bluetooth low energy device for the automotive market.  From assisted parking to smartphone car access, including passive entry passive start (PEPS) and remote keyless entry (RKE), the new CC2640R2F-Q1 solution will pave the way for emerging automotive applications.

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1.     Bluetooth 5 Software Support

Ready to design more intelligent beacons, longer range applications, or transfer data at higher speeds?  The SimpleLink CC2640R2F wireless MCU has Bluetooth 5 software support coming soon in the first half of 2017.

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It’s a new year, new Bluetooth spec. Jumpstart your new designs with CC2640R2F wireless MCU today!

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