SSZTBM3 February 2016 CC2564 , CC2564MODA
It’s here! Our new dual-mode Bluetooth® CC2564 module (CC2564MODA) enables developers to get their simple, low-power connectivity solutions to market quickly and easily. Featuring an integrated antenna and the flexibility to support multiple microcontrollers (MCUs) and microprocessors (MPUs), the module delivers best-in-class range and performance for a variety of audio, wearable, industrial, medical and Internet of Things (IoT) applications.
It’s easy to use – Having a module with an integrated antenna is a simple way for anyone to add Bluetooth to their system. Our new module allows for development with no prior RF expertise necessary.
It’s a robust solution – The new CC2564 module speeds up time to market because of its certified RF design. The modules are Bluetooth 4.1 compliant and FCC/IC/CE certified, ensuring interoperability and providing a significant cost savings when transferred to end products.
It provides design flexibility – TI makes it easy to develop Bluetooth applications for multiple MCU/MPUs with the flexibility of multiple devices and tools, software and support. The new CC2564 module was designed to work with a wide variety of MCU/MPUs including TI’s MSP430™ MCUs, TM4C MCUs and Sitara™ AM335x processors as well as options outside of our portfolio. TI also offers flexible software options for the module including a royalty-free TI-supported stack, with multiple profiles and sample applications for Bluetooth and Bluetooth low energy.
The new dual-mode Bluetooth CC2564 modules are available now through the TI Store and through TI authorized distributors. Start the design process now by doing one of the following:
A BoosterPack™ plug-in module for this solution is now available to help kick-start your design along with software stack support on the MSP432™ MCU platform. For more information, documentation and more on the dual-mode Bluetooth CC2564 module with integrated antenna, click the button below.