Victor Ceron
Cars of all sizes and price ranges are delivering a growing array of entertainment and information to enhance the driving and riding experience. Today’s factory-installed head units typically combine entertainment, multimedia and driver information into one module; they offer AM/FM and satellite radio, a CD/DVD player for music and video, a navigation system, data and multimedia ports (USB, Bluetooth®, line in, line out, video in), and general and vehicle status information.
The head unit is indeed the brain and centerpiece of the car’s sound system. Modern head units are very complex automotive systems, integrating high-speed processors and interface lines, very sensitive signal-chain blocks, and high-output power audio and power supply components densely integrated in the center of the dashboard.
Given such tight space restrictions, printed circuit board (PCB) area and component count come at a very high premium in automotive head-unit systems. It is imperative for automotive original equipment manufacturers (OEMs) to consolidate functionality and minimize subsystem size to make room for additional differentiation.Figure 1 is a very simplified block diagram of a typical head-unit system.
In the figure, you’ll notice that:
Automotive system designers have basically two alternatives when selecting the best audio amplifier for their automotive head-unit systems: Class-AB or Class-D.
Class-AB audio amplifiers are today’s standard in automotive audio. They are linear amplifiers that generate no electromagnetic interference (EMI) and do not require many external electronic components. They are highly inefficient, however, and require substantial passive or even active thermal management in the form of heat sinks and fans.
On the other hand, Class-D audio amplifiers are highly efficient switching amplifiers that need very little thermal management; however, they do require output inductors that are not exempt from EMI concerns.
Class-D audio amplifiers are rapidly gaining in popularity as their advantages over Class-AB become more evident and their total system cost approaches parity with Class-AB systems.
As infotainment systems become more sophisticated, car manufacturers have increased their speaker channel count to improve system differentiation and market appeal. The power demands on the head-unit audio amplifier increase with the number of speaker channels needed, but space and heat dissipation restrictions limit the power dissipation in the head unit to just a few watts.
In Class-AB-based head units, you can solve this problem by adding an external audio-amplifier box or trunk amplifier, although it increases system complexity and cost greatly.
The high efficiency of Class-D-based head units makes it possible to match the power demands of high-channel-count systems without an external audio amplifier. Their low-power dissipation enables multi-IC implementation directly in the head unit, providing a more cost-effective and simple solution.
TI’s automotive Class-D amplifiers’ high efficiency reduces heat dissipation and total system cost by eliminating the use of fans and expensive aluminum heat-sink panels; compared to Class-AB amplifiers, Class-D amplifiers like TI TAS5404-Q1 enables higher channel count, subwoofer 2Ω load capability, and output power in the head unit with no need for an external amplifier.
By leveraging reduced-sized, low-cost, automotive-grade metal-alloy inductors, these Class-D amplifiers reach a very small solution size, down to 10cm2, and allow may allow six or more channels in space-constrained head-unit systems.
In part 2 of this blog series, I will discuss EMI. In the meantime, log in to post a comment below and let me know about your challenges with head-unit audio design and space constraints.
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated