SWRA672
May 2020
AWR6843AOP
,
IWR6843AOP
Thermal Design Guide for Antenna on Package mmWave Sensor
Trademarks
1
Introduction
2
mmWave AoP package
2.1
Thermal Characteristics of the Package
3
Salient features of AoP EVM
3.1
Thermal Challenges in Dissipating the Heat
4
Techniques for Mitigating the Heat Dissipation
4.1
Reduce the System Level Thermal Resistance
4.2
Board Size Scaling
4.3
Heatsink Options
4.3.1
Sheet Metal Heat Sink
4.3.2
Heat Sink Details
4.3.3
Mounting Options
4.3.4
Thermal Characteristics With the Sheet-Metal Heatsink
4.4
Heatsink with fins
4.4.1
Thermal Characteristics With the Heatsink
5
PCB based thermal improvements
5.1
Thermal via array
6
Application and Demos
7
Summary
8
Acknowledgment
9
References
4
Techniques for Mitigating the Heat Dissipation