SWRA672 May   2020 AWR6843AOP , IWR6843AOP

 

  1.   Thermal Design Guide for Antenna on Package mmWave Sensor
    1.     Trademarks
    2. 1 Introduction
    3. 2 mmWave AoP package
      1. 2.1 Thermal Characteristics of the Package
    4. 3 Salient features of AoP EVM
      1. 3.1 Thermal Challenges in Dissipating the Heat
    5. 4 Techniques for Mitigating the Heat Dissipation
      1. 4.1 Reduce the System Level Thermal Resistance
      2. 4.2 Board Size Scaling
      3. 4.3 Heatsink Options
        1. 4.3.1 Sheet Metal Heat Sink
        2. 4.3.2 Heat Sink Details
        3. 4.3.3 Mounting Options
        4. 4.3.4 Thermal Characteristics With the Sheet-Metal Heatsink
      4. 4.4 Heatsink with fins
        1. 4.4.1 Thermal Characteristics With the Heatsink
    6. 5 PCB based thermal improvements
      1. 5.1 Thermal via array
    7. 6 Application and Demos
    8. 7 Summary
    9. 8 Acknowledgment
    10. 9 References

4.4.1 Thermal Characteristics With the Heatsink

Figure 16 shows the thermal characteristics of the mmWave sensor board across different duty cycles using FIN based heatsink.

In this example, two cases are taken:

  • PCB without using heatsink
  • PCB with FIN metal based heatsink.

Figure 16 shows that FIN-metal based heatsink provides even more improvement in reducing the junction temperature over the sheet metal based heatsinks for various duty-cycle conditions.

Thermal_characterstics_with_FIN_heatsink.pngFigure 16. Thermal Characteristics of mmwave AoP Sensor With and Without FIN Metal-Based Heatsink