SWRS207H January   2018  – March 2021

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       36
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

5 Revision History

Changes from May 19, 2020 to March 30, 2021 (from Revision G (May 2020) to Revision H (March 2021))

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated to Bluetooth 5.2 throughout the documentGo
  • Added 3-wire, 2-wire, and 1-wire PTA coexistence mechanisms to the "Radio Section" list in Section 1 Features Go
  • Removed Wi-SUN in the Wireless protocals list items in Section 1 Features Go
  • Changed the test condition to "Zero cycles" for the Flash sector erase time parameter in Section 8.7, Nonvolatile (Flash) Memory Characteristics Go
  • In Section 8.10: Updated data rate error tolerance (255-byte packets), Selectivity ±2MHz, Selectivity, and Image frequency for 125 kbps (LE coded); Updated data rate error tolerance (255-byte packets), Selectivity ±2MHz, Selectivity, and Image frequency for 500 kbps (LE coded); Updated data rate error tolerance (37-byte packets), Selectivity ±2MHz, and Selectivity ±3MHz, for 1 Mbps (LE 1M); Updated Receiver sensitivity and Selectivity, ±4MHz for 2Mbps (LE 2M)Go
  • Changed note (1) in Section 8.14.2, Wakeup Timing Go
  • In Section 8.12: Updated Receiver sensitivity, Blocking and desensitization for 10 MHz, 20 MHz, and 50 MHz, from upper band edge; and Blocking and desensitization for -5 MHz and -10 MHz from lower band edge Go
  • Changed the frequency of the input tone for 14-bit and 15-bit mode in Section 8.15.1.1 Go
  • Changed the TYP Offset error and TYP Max code output voltage variation for VREF = VDDS = 3.8 V, 3.0 V, and 1.8 V in Section 8.15.2.1 Go
  • Updated Figure 8-11, Figure 8-13, and Figure 8-16 Go
  • Added PTA description in Section 9.3, Radio (RF Core) Go
  • Added the paragraph that begins "Integrated matched filter-balun devices can be used…" in Section 10.1, Reference Designs Go