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  • CC2564C TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs

    • SWRU497B August   2019  – December 2021 CC2564C

       

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  • CC2564C TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs
  1.   Trademarks
  2. 1Introduction
  3. 2Features
    1. 2.1 Classic Bluetooth Profiles Available
    2. 2.2 Bluetooth Low Energy Profiles Available
    3. 2.3 MFi Support
  4. 3Requirements
  5. 4Sample Application Overview
  6. 5Hardware Setup
    1. 5.1 Setting Up the Hardware
  7. 6Software Setup
    1. 6.1 Downloading and Installing
    2. 6.2 Building and Flashing the Bluetooth Code (MSP-EXP432P401R)
  8. 7Sample Applications
    1. 7.1 Classic Bluetooth Sample Applications
    2. 7.2 Classic Bluetooth + Bluetooth Low Energy Sample Applications
    3. 7.3 Bluetooth Low Energy Sample Applications
  9. 8Revision History
  10. IMPORTANT NOTICE
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USER'S GUIDE

CC2564C TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs

Trademarks

LaunchPad, BoosterPack, and Code Composer Studio are trademarks of Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

Keil, Arm, and µVision are registered trademarks of Arm Limited (or its subsidiaries).

IAR Embedded Workbench is a registered trademark of IAR Systems AB.

All trademarks are the property of their respective owners.

1 Introduction

The CC2564C dual-mode Bluetooth® stack on MSP432™ microcontroller unit (MCU) software (CC2564CMSP432BTBLESW) for Bluetooth and Bluetooth Low Energy from TI enables the MSP432 MCU and is comprised of single-mode and dual-mode offerings implementing the Bluetooth 5.1 specification. The Bluetooth stack is fully qualified (QDID 85355 and QDID 69886), provides simple command line sample applications to speed development, and has MFi capability upon request.

For a complete evaluation solution, the CC2564CMSP432BTBLESW software development kit (SDK) works directly with the MSP-EXP432P401R LaunchPad™ Development Kit. The stack for the MSP432 MCU is certified and royalty free (CC2564CMSP432BTBLESW).

The software works with the dual-mode Bluetooth CC256XCQFN-EM evaluation module (EM) through the BOOST-CCEMADAPTER. For audio and voice applications, the software requires an audio codec EVM like the CC3200AUDBOOST. The software also provides a complete Bluetooth BR, EDR, and low energy HCI solution that reduces design effort and ensures a faster time to market. The dual-mode Bluetooth BoosterPack™ Plug-in Module includes TI's seventh-generation Bluetooth core and provides a product-proven solution that is Bluetooth 5.1 compliant. The device provides one of the best Bluetooth RF performances with a transmit power and receive sensitivity that provides a range of about 2× compared to other Bluetooth Low Energy only solutions. TI’s power-management hardware and software algorithms provide significant power savings in commonly used Bluetooth BR, EDR, and Low Energy modes of operation.

 

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