TIDT315 December 2022
Output Current | Pure PCB, no Airflow |
Pure PCB, Airflow >0.5 m/s |
+ Adapter, no Airflow |
+ Heat Sink, Horizontal |
Heat Sink, Vertical | Heat Sink,Airflow < 0.5 m/s |
---|---|---|---|---|---|---|
10 A |
35.3°C |
n/a |
n/a |
n/a |
n/a |
n/a |
20 A |
42.8°C |
n/a |
n/a |
n/a |
n/a |
n/a |
30 A |
52.4°C |
n/a |
49.8°C |
47.7°C |
40.6°C |
35.0°C |
40 A |
65.4°C |
n/a |
60.4°C |
56.1°C |
48.9°C |
38.6°C |
50 A |
81.4°C |
45.4°C |
73.5°C |
66.4°C |
57.9°C |
44.5°C |
60 A |
n/a |
52.5°C |
89.6°C |
77.6°C |
68.5°C |
49.8°C |
Figure 5-1 shows at 50-A output current that any forced cooling helps most. The benefit of the adapter by itself is not significant, the PCB all alone (4 × 105-µm copper) spreads the heat reasonably and the adapter does not increase the surface. Adding the heat sink (or a metal case) increases this surface further, reduces the temperature rise - but the position for best thermal convection is important.