TIDT427 December   2024

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5. 1Test Prerequisites
    1. 1.1 Voltage and Current Requirements
    2. 1.2 Dimensions
    3. 1.3 Considerations
  6. 2Testing and Results
    1. 2.1 Efficiency Graph
    2. 2.2 Efficiency Data
      1. 2.2.1 30V Input Voltage
      2. 2.2.2 48V Input Voltage
      3. 2.2.3 60V Input Voltage
    3. 2.3 Thermal Images
      1. 2.3.1 Thermal Images at 48VIN, 12VOUT, 10A, No Heatsink
      2. 2.3.2 Thermal Images at 48VIN, 12VOUT, 20A, RS-PRO 750-0951 Heatsink
    4. 2.4 Bode Plots
      1. 2.4.1 30V Input Voltage
      2. 2.4.2 48V Input Voltage
      3. 2.4.3 60V Input Voltage
  7. 3Waveforms
    1. 3.1 Switching
      1. 3.1.1 48V Input Voltage
        1. 3.1.1.1 0A Output Current
        2. 3.1.1.2 20A Output Current
      2. 3.1.2 60V Input Voltage
      3. 3.1.3 30V Input Voltage
    2. 3.2 Output Voltage Ripple
    3. 3.3 Input Voltage Ripple
    4. 3.4 Load Transients

2.3.2 Thermal Images at 48VIN, 12VOUT, 20A, RS-PRO 750-0951 Heatsink

PMP31349 Top Side: Inductor (95°C), GaN IC Thermal Pad Vias (92°C)Figure 2-4 Top Side: Inductor (95°C), GaN IC Thermal Pad Vias (92°C)
PMP31349 Bottom Side: Heatsink (76°C)Figure 2-5 Bottom Side: Heatsink (76°C)